June 7, 2011, Issaquah, Washington, USA – Silicon Designs, Inc. (www.SiliconDesigns.com), a global industry supplier of highly rugged industrial-grade MEMS capacitive accelerometer chips and modules with integral amplification, announced that it will be showcasing its latest sensing technologies at this week’s Sensors Expo & Conference, June 7-8 in Rosemont, Illinois.
Products on display at booth 506 will include the industry best-selling 2260 series of MEMS capacitive accelerometer modules, nominated for a 2011 “Best of Sensors Expo” Award. The series has been recently expanded to include new low-frequency ranges to 0 Hz within a footprint that is 37% smaller than typical industry single axis models. Also on display will be the company’s complete range of high-reliability accelerometers for zero-to-medium frequency test and measurement requirements.
Silicon Designs accelerometers are available in ranges from 2 to 20K g, with most models operating in temperatures up to +125°C. On-board voltage regulation and an internal voltage reference minimize temperature and voltage changes while eliminating additional external power regulation. Carefully regulated manufacturing processes ensure that each sensor is made to be virtually identical, allowing users to swap out parts in the same g range with few to no testing modifications, saving time and resources. This also provides test engineers with a quick plug-and-play solution for almost any application, while maintaining total trust in sensor accuracy when used within published specifications. As the OEM of its own MEMS-based accelerometer chips and modules, Silicon Designs is able to ensure quality, offer custom design and still keep prices highly competitive. The company’s chips and modules are used in a wide range of equipment and applications, including crash event detection, missile launch, downhole vibration, automobile development, race car instrumentation, shipping monitoring, airplane flutter testing, turbine engine precession, and structural integrity monitoring of bridges, hydroelectric power generators, and wind farm turbines, as well as automotive interior panels, HVAC systems, lights and electrical systems, door assemblies and windows, UAV flutter testing and wind turbine tip vibration monitoring.
Sensors Expo & Conference will bring together over 4,000 engineers, scientists and industry professionals from around the world to see the latest innovations in sensor technology, learn about the most important sensing trends and network with industry leaders. This year’s event will be co-located with the Embedded Systems Conference (ESC) Chicago and feature a MEMS Pavilion, Energy Harvesting Pavilion, Technology Update Theater and the Best of Sensors Expo Awards presented by Sensors Magazine. This year marks Silicon Design’s eighth year as an exhibitor at the annual expo, where the company’s technical experts will be available to perform interactive demonstrations of multiple accelerometer modules, offer applications engineering expertise and provide detailed product documentation. For more information about Silicon Designs and its available product range, visit www.silicondesigns.com.
About Silicon Designs, Inc.
Based in Seattle, Washington, USA, Silicon Designs, Inc. (www.SiliconDesigns.com) specializes in industrial grade capacitive accelerometers with integrated amplification and an extremely rugged design. As the OEM of its own MEMS-based accelerometer chips and modules, SDI is able to ensure quality, offer custom design, and still keep prices highly competitive. SDI accelerometer models are available from 2 g to more than 20,000 g. Within the standard range (2 to 400 g), most of our accelerometers can continue in operation after sustained exposure of up to 10,000 g and limited temperature exposure to temperatures above +200°C. SDI’s chips and modules are used in a wide range of equipment and applications, including crash event detection, missile launch, downhole vibration, automobile development, race car instrumentation, shipping monitoring, airplane flutter testing, turbine engine precession, and structural integrity monitoring of bridges, hydroelectric power generators, and wind farm turbines.