Sometimes keeping a low profile (literally) can be a good thing, when considering the nooks and crannies of today’s space-constrained military and aerospace systems into which components must sometimes be shoehorned. These systems might be 3U VPX or even OpenVPX, but regardless of the form factor chosen, high density is the new “in” thing. Swissbit AG, apparently in touch with the trend, recently created its DDR3 Ultra Low Profile (ULP) Registered DIMM (RDIMM) memory module. Standing at a mere 17.75 mm (that’s 0.699”), the high-performance DDR3 ULP RDIMM more than meets JEDEC’s height requirements too.
Available in 2 and 4 GB densities, the DDR3 ULP RDIMM is tailored for small blade server and compact server apps in the defense, medical, industrial, and communications realms. At speeds of 800 Mb, 1,066 Mb, or 1,333 Mb, this memory device is ready to perform – and to last. It withstands commercial temp ranges of 0 to +70 °C and an industrial temp range of -40 °C to +85 °C. We think being this dense is just plain smart.