RENO, NEVADA, December 15, 2006- Sundance, a worldwide supplier and manufacturer of advanced digital signal processing (DSP) and reconfigurable computing platforms, today announced the availability of a conduction cooled PMC/XMC module, code named SMT417. With its fast 133MHz, 64bits PCI interface and blistering power provided by two Texas Instruments 1GHz TMS320C6416 DSPs and a Xilinx XC2VP50 FPGA, SMT417 is ready to tackle many applications in military, medical imaging, telecommunications and other demanding fields. With full support by PARS, and 3L Diamond development tools parallel applications can be developed to utilize all the available DSP and FPGA resources seamlessly.
Main features of SMT417 are:
• Conduction cooled
• two 1GHz TI’s TMS320C6416 DSP
• Xilinx XC2VP50
• Up to 256 MB of SDRAM
• 2 Sundance High Speed Bus (SHB) 14 Rocket IO (RSL) interfaces
• 7 RocketIO RSL interfaces
• IEEE 1386 standard PMC form factor with conduction cooling
• 64bit / 66MHz PCI interface through PMC and 1 x8 or 2 x4 PCIe through XMC
• XMC.2 connector per ANSI/VITA 42.0 (42.2 for x4 RapidIO compatible)
• Supported by Diamond and PARS development software for multiprocessing
The SMT417 is designed to interface to other Sundance products including ADC, DAC, DSP, imaging and communications modules.
“This module is a powerful addition to our extensive family of Sundance products where it can serve as a pre-processing, post-processing or as a stand alone module in many types of signal processing and conditioning applications” explains Dr. Nory Nakhaee, President and CEO of Sundance DSP in Reno, Nevada.
About Sundance
Sundance DSP Inc. is a US-based, independent company headquartered in Reno, Nevada. Sundance group has its headquarter in Chesham UK, with offices in China and Italy. The company designs, develops, manufactures and markets high performance signal processing and reconfigurable systems for original equipment manufacturers in the wireless and signal processing markets. Leveraging its multiprocessor expertise and experience, Sundance provides OEM with modular DSP and FPGA-based systems as well as, Data Acquisition, I/O, Communication, and interconnectivity products that are so essential to multiprocessor systems where scalability and performance are important. With over fifty different modules and carriers for PCI, cPCI VME and Stand Alone platforms, Sundance is a solution provider to semiconductor, pharmaceutical, and factory automation industries. Sundance, founded in 1999 by current directors, is a TI third party, Xilinx Xperts and MathWorks’ Connection program member.
