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  Conferences and Awards  Visit ADLINK at the ESC Chicago 2011 for the Latest Embedded Solutions will present their newest embedded solutions at the Embedded Systems Conference Chicago from June 6 to 8, 2011 in Chicago, IL.
Conferences and Awards

Visit ADLINK at the ESC Chicago 2011 for the Latest Embedded Solutions will present their newest embedded solutions at the Embedded Systems Conference Chicago from June 6 to 8, 2011 in Chicago, IL.

ADLINK TechnologyADLINK Technology—June 7, 20110
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June 06, 2011, San Jose, CA – ADLINK Technology, Inc., a leading provider of embedded platform products and services, will present their newest embedded solutions at the Embedded Systems Conference Chicago from June 6 to 8, 2011 in Chicago, IL. ADLINK will exhibit its ASD Solid State Drive lineups, new Smart Panel products, platforms featuring the 2nd generation Intel® Core™ processor family and the Intel® Atom™ processor E6xx series, as well as rugged fanless embedded computers and compact vision systems

ADLINK ASD Series of SATA 6 Gb/s SSDs

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The ADLINK ASD Series is designed to meet the needs of today’s mission critical applications in severe environments and reduce time-to-market for rugged platform integrators who require comprehensive solutions to provide embedded platforms with high availability, performance and reliability. ADLINK ASD SSDs provide a SATA 6 Gb/s (SATA III) interface to match the data transfer capabilities of 2nd generation Intel® Core™ processor-based platforms and have the fastest read/write speeds available on the industrial market. The ADLINK ASD Series offers reliability, ruggedness and extreme performance, allowing ADLINK to provide a complete storage solution for its customers.

ADLINK Smart Panel Series

The ADLINK Smart Panels incorporate an LCD touch panel, industrial motherboard and Internet access. Among the key benefits of Smart Panel equipped devices are reduced design burden, fewer BOM items, decreased risk, faster time to market, and minimized NRE costs. The Smart Panel is a base component that provides a building block for system integrators for develop their end-user devices, implementing their final application requirements for devices such as medical instruments, POS systems, test instruments, automation devices, tabletop ordering systems, and banking systems.

Customers who currently purchase a motherboard and display module for assembly into final products can recognize the increased value represented by Smart Panel deployment. Compared to the requirements of system design using a motherboard and display module, design task reduction becomes significant from the concept development stage to the NPI stage. The resources that are freed up can be invested in other product development. In addition, ADLINK Smart Panels are backed by comprehensive testing of hardware and software compatibility, relieving designers from the burden of dealing with individual parts suppliers.

Other product highlights at ESC Chicago 2011 include ADLINK’s new embedded platforms featuring the 2nd generation Intel® Core™ processor family and the Intel® Atom™ processor E6xx series in a variety of form factors, such as CompactPCI®, COM Express™, PICMG® 1.3, ATX, Mini-ITX, as well as the newest additions to the Ampro by ADLINK™ Extreme Rugged™ product line. ADLINK will also showcase the rugged fanless embedded computers and compact vision systems based on the latest Intel® microarchitectures. Visit ADLINK at Booth 1114, ESC Chicago to witness the progress and experience ADLINK’s products in person.

About ADLINK

ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA®, CompactPCI®, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, ISO-13485, and TL9000 certified, is an Associate Member of the Intel® Embedded Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, and a Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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