Company to Highlight Rugged Electronic Packaging Solutions for Versatile Thermal Management and Cooling at Largest State-of-the-art Defense and Technology Exposition and Conference on the West Coast
Brockton, MA., January 25, 2010 – SIE Computing Solutions Inc., a provider of rugged electronic packaging solutions for mission-critical embedded computing platforms deployed in harsh environments, today announced that the company will be exhibiting at The Western Conference and Exposition, West 2010, co-sponsored by AFCEA and the U.S. Naval Institute. West 2010 will take place at the San Diego Convention Center in San Diego, CA from February 2-4, 2010 and will feature exhibits from 400 technology leaders, as well as discussions by leading military experts and analysts addressing various topics related to national defense.
At booth #1605, SIE will be showcasing the company’s 700 Series line of ATR enclosures. The 700 Series offers a wide range of COTS solutions, which are available in an expansive range of ARINC sizes and are easily configurable to meet a variety of custom sizes and design feature requirements. Additionally, 700 Series enclosures accept a variety of bus structures including VME, VME64x, VXS, VPX and CompactPCI technologies, as well as application-specific custom designs.
Featured products on display will include the 714 Series Air Cooled ATR enclosure, designed for maximum strength and lightweight deployment. With its aluminum frame and construction modeling the fabrication techniques used in the manufacture of today’s commercial and military aircraft, the 714 provides flexibility in size, with solid rivet technology and reinforced aluminum outer panels to form a rugged ATR that can withstand even the most severe shock and vibration environments.
SIE also recently introduced unique frame designs for applications utilizing conduction cooled cards in the 716 Series Conduction Cooled ATR. The 716 Series offers a lightweight alternative to meet the stringent weight requirements for airborne applications, while providing optimal cooling and maintaining flexibility in configuration.
SIE’s 717 Air-Over Conduction Cooled ATR enclosure incorporates folded fin material brazed between the conducting wall and outer panel, and a machine finned rear panel to help increase thermal planes for maximum heat dissipation. When combined with an auxiliary external fan, the 717 Series can increase thermal dissipation by over 30% in comparison to conventional conduction cooling. The 714, 716 and 717 Series can also be configured with an optional avionics tray for isolation from the shock and vibration environments that are common to airborne, vetronics and shipboard applications.
SIE’s newest introduction to the 700 Series line, the 720 Series Liquid Cooled ATR, meets the cooling requirements of today’s high thermal load systems that cannot be satisfied by convection and conduction cooling alone, such as those based on VPX technology and other power intensive platforms. It is designed to utilize a variety of fluids for thermal cooling and features conducting walls that allow for front or rear fluid access.
“SIE Computing Solutions’ 700 Series enclosures are purpose-built to address the critical issues surrounding ATR deployments such as thermal management, weight, and functionality, which makes them well-suited for a wide variety of products as traditional ATR techniques are being applied in new applications,” said Jim Tierney, vice president of government systems at SIE Computing Solutions. “As the largest state-of-the-art defense and technology exposition and conference on the West Coast, West 2010 provides us with an optimal environment to meet with industry insiders, and we look forward to exhibiting at this year’s event.”
SIE Computing Solutions has an almost 40 year history of bringing computing solutions to complex, highly demanding environments such as those of extreme temperatures, humidity, dust, sand, vibration, weight, etc. SIE technology has been used in high-profile military programs such as JLTV, Patriot Missile program, Sea Sparrow and the DDG-51 upgrade program.
About SIE Computing Solutions
SIE Computing Solutions, Inc. specializes in rugged electronic packaging solutions for mission-critical embedded computing platforms deployed in harsh environments. With deep engineering expertise addressing the challenges in thermal design, signal integrity, complex interconnection and power management technologies, SIE provides enclosures, backplanes, system integration and custom engineering solutions for VME, VPX, CompactPCI, xTCA, small form factors and more. As a preferred vendor to the world’s largest defense and industrial companies, SIE customers leverage best-in-class processes from initial concepts, design and development, prototypes, certifications and production.
Founded in 1971, SIE Computing Solutions’ organization is vertically integrated and serves the military, transportation, oil & gas exploration, medical, telecommunications and other industrial/emerging markets. SIE Computing Solutions’ facilities are ISO 9001/2008 and ISO14001/2004 certified to ensure the delivery of consistently high quality products. Based in Brockton, Massachusetts, SIE Computing Solutions is a wholly-owned subsidiary of S.I.E. AG, a privately-held embedded computing company. For more information on SIE Computing Solutions, visit www.sie-computing.com, call 1.800.926.8722, or email [email protected].