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  Consortia and Working Groups  European, North American, and Asian Global RapidIO Design Summits Scheduled for Fall 2007
Consortia and Working Groups

European, North American, and Asian Global RapidIO Design Summits Scheduled for Fall 2007

RapidIO Trade AssociationRapidIO Trade Association—June 5, 20070
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The RapidIO Trade Association announced its Fall 2007 Global RapidIO Design Summit schedule, with events slated for Europe, North America and Asia. These highly anticipated events provide engineering managers, system architects, and embedded product developers with practical information on RapidIO technology and products they can utilize now in their production products.

“These summits, developed specifically to illustrate how the embedded design community can achieve improved system performance and reliability with the high-speed, flexible RapidIO interconnect and fabric, are among the most highly attended RapidIO design events held each year,” said Keith Woodard, chairman of the Rapid IO Trade Association Customer Programs sub-committee. “The member companies of the Trade Association are dramatically expanding the presentations and hardware demonstrations this year, with a focus on practical designs and implementations using RapidIO interconnect technology.”

The free, full-day events include two tracks of technical sessions highlighting RapidIO technology, applications examples, software considerations, practical design recommendations, and RapidIO products. In addition, a technology lab will feature multi-vendor RapidIO interoperability demonstrations using state-of-the-art RapidIO products from multiple vendors. Technical personnel from Trade Association member companies will provide a unique opportunity for attendees to interact directly with RapidIO Technology experts and get their specific questions answered. A complimentary light breakfast, lunch and snacks will be provided.

Global RapidIO Design Summits Schedule

• Munich, Germany – Monday, 17 September 2007

• Paris, France – Thursday, 20 September 2007

• Boston, Massachusetts, United States – Thursday, 04 October 2007

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• Seoul, Korea – Monday, 05 November 2007

• Shanghai, People’s Republic of China – Wednesday, 07 November 2007

• Shenzhen, People’s Republic of China – Friday, 09 November 2007

• Hyderabad or Chennai, India – Tuesday, 13 November 2007

• Bangalore, India – Thursday, 15 November 2007

Additional details can be found on www.RapidIO.org. Dates of these events are subject to change, and interested attendees are asked to check the web site often for location and agenda information.

Hosted by the RapidIO Trade Association, the 2007 Global Design Summit presentations and demonstrations are supplied by the Trade Association member companies.

RapidIO Trade Association

The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO and ANSI-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.

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RapidIO® is a registered trademark of the RapidIO Trade Association. Product and company names mentioned may be trademarks and/or registered trademarks of their respective holders.

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