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  New Products  IOxOS Technologies unveils its new Multi Purpose Carrier platform based on latest Xilinx Virtex-6T FPGA for high-density IO demanding applications
New Products

IOxOS Technologies unveils its new Multi Purpose Carrier platform based on latest Xilinx Virtex-6T FPGA for high-density IO demanding applications

IOxOS Technologies SAIOxOS Technologies SA—November 1, 20100
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Geneva (Switzerland), November 2010 – IOxOS Technologies introduces the MPC_1200, a 6U VME64x Multi Purpose IO Carrier board based on latest Xilinx Virtex-6T and Spartan-6 40nm FPGAs. Thanks to the high capacity and the extreme performance of these high-end FPGA devices, very sophisticated applications can be implemented in a standard VME64x environment.

Compared to other products based on mezzanine cards extension (i.e, FMC or XMC), the MPC_1200 edge-to-edge interconnection solution provides full PCB area utilization, direct VME64x front panel access without any restriction on front panel connectors type, and enhanced air cooling capability with standard heat-sink, while keeping modularity and versatility.

For applications requiring a high-density IO connection, a single MPC_1200 carrier can control several VME64x units drastically reducing the cost per IO point of connection. The interconnect expansion is made with high-performance connectors supporting data rates up to 11 Gb/s, making possible to interface today’s high- speed protocols such as Gigabit Ethernet and PCI Express. The MPC_1200 also features the new 3M Ultra Hard Metric (UHM) connector technology which enhances the legacy VME64x P0 connector with high-speed serial protocols supporting data rates up to 5 Gb/s (such as PCI Express and Serial RapidIO).

The MPC_1200 carrier board can host two single-width or one dual- width MPF (Multi Purpose Front-end) IO modules for expansion purposes. A dual-width MPF IO module provides extended PCB area (around 50% of an entire VME 6U board) with full front panel accessibility. IOxOS Technologies is developing a comprehensive family of MPF IO modules to make the most of the MPC_1200 capabilities. The first member of this product line features a Freescale P2020 dual-core processor and two FMC (LPC) extension slots, to convert the MPC_1200 in a versatile Single Board Computer with embedded FPGA capability to target high-density IO applications.

TOSCA II, a comprehensive FPGA Design Kit developed by IOxOS Technologies, is available for the implementation and integration of custom applications within the MPC_1200 on-board Virtex-6T FPGA, which supports the following FF1156 devices: LX130T, LX195T, LX240T, LX365T, SX315T and SX475T.

The MPC_1200 has been developed in collaboration with the Institute Laue-Langevin (ILL) in Grenoble (France), an international research centre at the leading edge of neutron science and technology.

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