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| Layout of load board |
PCI-SYSTEMS Inc., a leading supplier of conduction cooled systems, today announced a 3U VPX RL Thermal Load Simulation Module, enabling accelerated development of rugged conduction cooled embedded systems.
The chassis can be monitored with temp sensing probes and or FLIR imaging. Different wattages are selected by setting dip switches. The +5 and 3.3V loads are on the top of the module. The +12V and -12V loads are on the bottom side of the module. Eight incremental settings are available
on each power rail. Can be configured to dissipates much as 130 watts
• +5.0V: 8×5 watts=40 watts max
• +3.3V: 8×5 watts=40 watts max
• +12.0V: 8×5 watts=40 watts max
• -12.0V: 8×1,5 watts =12 watts max
• +3.3Vaux 8×0,75 = 6 watts max
