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  Technology Partnerships  Silicon 360 Announces Agreement with Integrated Device Technology, Inc to Productize Enhanced Bridge Products
Technology Partnerships

Silicon 360 Announces Agreement with Integrated Device Technology, Inc to Productize Enhanced Bridge Products

Silicon Turnkey SolutionsSilicon Turnkey Solutions—June 17, 20110
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Milpitas, California – June 6, 2011- Silicon 360, LLC (Si360®), a leading enablement provider offering complete end-to-end semiconductor products and services, today announced that they have entered into an exclusive agreement with Integrated Device Technology, Inc, the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, that enables Si360 to manufacture and sell Universe II PCI-to-VMEbus Bridge products in various high-reliability and ruggedized versions.

This definitive agreement establishes Si360 as the sole supplier for these industry-leading high performance bridge products and ensures a continuous supply of ceramic and enhanced plastic package versions of Universe II, with customized flows, up-screening, and value-added options. IDT will continue to sell their standard CA91C142D products to their existing customers.

“This agreement further strengthens the synergistic partnership and extends the product portfolio between IDT and Si360,” said Don Pecko, Business Manager of Si360. “Designers of military and aerospace systems will now be able to utilize these industry-leading PCI-to-VMEbus bridge products in their newest applications such as VME Single Board Computers and I/O peripheral boards.”

The three new ruggedized product versions are:

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Part Number Frequency Voltage Temperature Package
CA91C142D-33IB 33 MHz 5.0V -40°C to 85°C DBGA
CA91C142D-25EB 25 MHz 5.0V -55°C to 125°C DBGA
CA91C142D-25EEEP
(Enhanced Plastic)
25 MHz 5.0V -55°C to 125°C PBGA

For additional product or sales information, please contact [email protected].

About Si360

Silicon 360, LLC, a subsidiary of Silicon Turnkey Solutions, enables its semiconductor and clean-tech customers to meet time-to-market, cost and technical challenges in today’s consumer, military, aerospace and green applications by integrating concurrent engineering, manufacturing, test and qualifications processes with operational innovations to provide leading edge technology and services. Further information can be found at www.silicon360.com.

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