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  Industry News  ITT Develops High Temperature Micro Connector Assemblies for Use In Harsh Environments
Industry News

ITT Develops High Temperature Micro Connector Assemblies for Use In Harsh Environments

ITT Interconnect SolutionsITT Interconnect Solutions—April 21, 20080
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SANTA ANA, Calif. – April 21, 2008 – ITT Interconnect Solutions, a leading global manufacturer and supplier of connectors, interconnects, and cable assemblies, has developed a series of high temperature micro connectors. Designated the MDM Series, the connectors are rated for operation to 200°C and can be terminated in daisy-chain configurations within complex electronic instrumentation packages.

“We’ve had a number of requests from customers for a connector solution that accommodates larger wire sizes, which in turn requires the use of high temperature back molding materials,” said Keith Teichmann, director of marketing for ITT Interconnect Solutions. “The MDM Series connectors feature an integrated termination method to accommodate multiple conductor sizes and precision back molding, allowing us to meet our customers precise needs.”

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Typical applications for the MDM Series high temperature connectors include geophysical and oil exploration, electronic instrumentation and down-hole mapping.

The MDM Series connectors represent a complete turnkey solution based on the use of specialized high temperature materials such as LCP (liquid crystalline polymer) thermoplastic. A D-subminiature connector based on PPS (polyphenylene sulfide) thermoplastic can also be integrated into the assembly.

The micro connectors accept #22 and #26 AWG (American Wire Gauge) wire sizes and offer a combination of 1.27mm and 2.54mm (0.050″ and 0.100″) spacing. The MDM Series connectors also feature a twist pin contact system and crimped gold plated contacts.

Lead time for the custom MDM Series micro connectors is from 8 to 10 weeks.

About ITT Interconnect Solutions

ITT Interconnect Solutions is an international manufacturer and supplier of connectors including circular, rectangular, fiber optic, RF, power and high voltage, audio, PCMCIA, Compact Flash Card, enclosures, cable assemblies, and application specific custom solutions. The Interconnect Solutions portfolio includes the brands Cannon, VEAM, and BIW. For more information on ITT Interconnect Solutions and an archive of its press releases, please visit www.ittcannon.com.

About ITT

ITT Corporation supplies advanced technology products and services in several growth markets. ITT is a global leader in the transport, treatment and control of water, wastewater and other fluids. The company plays a vital role in international security through its defense communications and electronics products; space surveillance and intelligence systems; and advanced engineering and related services. It also serves the growing leisure marine and electronic components markets with a wide range of products. Headquartered in White Plains, NY, the company generated $7.8 billion in 2006 sales.

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