VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  Industry News  TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Quad Serial Communication AMC Module
Industry News

TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Quad Serial Communication AMC Module

TEWS TechnologiesTEWS Technologies—September 24, 20080
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail



TEWS TECHNOLOGIES today announced the TAMC863, a new synchronous/asynchronous serial AMC module with four high speed communication channels. The serial communication controller is implemented in FPGA logic, combined with the bus master capable PCI interface. It guarantees long term availability with the option to implement additional application specific functions for customers. The TAMC863 is designed for data communications, LAN/WAN networking, aerospace/defense communications, traffic control, simulation, and telecommunications applications.

More stories

PDTi SpectaReg cuts development time for Spectrum Signal Processing’s Latest Embedded Radio Module

December 5, 2007

New Desktop Supercomputer to Replace Clusters/Grids for Massive Parallel Processing Applications

March 17, 2009

Critical I/O Introduces First 10Gb Ethernet Networking Interface for Embedded and Military Systems

September 25, 2007

ARTiSAN gears up for the standardization of SysML with the launch of ARTiSAN Studio version 6.1

February 15, 2006

Several serial communication protocols are supported by each channel, such as asynchronous, isochronous, synchronous and HDLC mode. In addition, a maximum data rate of 10 Mbit/sec is provided for synchronous protocols and 2 Mbit/sec is supported for asynchronous protocols.

Multiprotocol transceivers are used for the line interface. The physical interface of each channel can be independently software selected for EIA-232, EIA-422, EIA-449, EIA-530, EIA-530A, V.35, V.36 or X.21. Physical connection is either through front panel I/O with an HD68 SCSI-V (VHDCI/Champ) type connector or rear I/O via P14.

In order to reduce CPU overhead and increase data rates for critical applications, the TAMC863 features a receive and transmit FIFO of 512 long words (32 bit) per channel. Data transfer on the PCI bus is handled via TAMC863 initiated DMA cycles with minimum host/CPU intervention. In addition, several interrupt sources can generate interrupts on INTA for each channel, and interrupts may be enabled or disabled separately.

Asynchronous and basic synchronous support for major operating systems such as Windows, Linux, VxWorks, and QNX is available.

About TEWS TECHNOLOGIES

TEWS TECHNOLOGIES is a leading solutions provider of embedded I/O and CPU products based on open architecture standards such as PMC, IndustryPack® (IP), CompactPCI, standard PCI, and VME. TEWS has more than 30 years of experience designing and building turn-key embedded interface solutions using the philosophy to listen and respond to our customers needs. Using this ‘customer first approach, TEWS has developed a large number of standard and custom products for applications in industrial control, telecommunication infrastructure, medical equipment, traffic control and aerospace/defense. TEWS line of embedded I/O solutions is available worldwide through a global network of distributors. For more information, go to www.tews.com.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
VMETRO expands VPX line with 6U VPX-REDI Buffer Memory Board
VMETRO continues VPX momentum with addition of 3U VITA 46 FPGA Processing Engine
Related posts
  • Related posts
  • More from author
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Load more
Read also
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Eletter Products

SPONSORED: VITA 67.3 Offerings from Teledyne Storm Microwave

February 3, 20260
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

February 1, 20260
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.