FREMONT, Calif., March 3, 2009 – SMART Modular Technologies (WWH), Inc. (“SMART” or the “Company”) (NASDAQ: SMOD), a leading independent manufacturer of memory modules, solid-state drives, embedded computing subsystems, and TFT-LCD display products, has expanded its DDR3 CoolFlex module product family with very low profile (VLP; 18.3mm) and standard height (30mm) registered DIMMs (RDIMMs). With these products, SMART combines leading-edge DDR3 technology with state-of-the-art flexible substrate technology to double system memory capacity. Ideal for use in high-performance computing (HPC), high end servers and workstation applications, these latest CoolFlex products include an 8GB VLP DDR3 RDIMM and a 16GB standard height DDR3 RDIMM running up to DDR3-1333.
CoolFlex is a proven technology that doubles memory density, reduces cost, and leverages multi-source DRAM supply chains with reliable, high-speed, thermally enhanced DDR3 DIMMs. By combining CoolFlex and DDR3 technologies, SMART offers OEM customers a practical and cost-effective high-density alternative to more expensive modules based on dual-die package (DDP) or quad-die package (QDP). “These new RDIMMs leverage the inherent performance advantages of CoolFlex technology and provide a clear example of SMART’s extensive high-speed design expertise across multiple PCB technologies,” said Mike Rubino, SMART’s Vice President of Worldwide Engineering.
The latest hybrid blade and server solutions combine computing power, virtualization, and storage, which are driving the need for higher memory capacity per processor core. OEM customers will need to use 16GB quad-rank RDIMMs to maximize functionality because DDR3 systems are equipped with a limited number of DIMM sockets per processor. In anticipation of this growing industry need for high density DDR3 modules, SMART has expanded its CoolFlex lineup.
Configured as dual-rank 1024Mx72, SMART’s CoolFlex 8GB VLP RDIMM allows blade OEM designers to populate their boards with up to six 8GB DIMMs per processor while using vertical sockets. With this new RDIMM, one 4-way 1U blade can be configured with up to 192GB of memory capacity. Using off-the-shelf 2Gb 512Mx4 DRAMs, SMART’s 16GB standard height CoolFlex RDIMM is configured as a quad-rank solution. Both the 8GB and 16GB CoolFlex modules are targeted at Intel®-based server systems.
SMART’s CoolFlex 8GB VLP RDIMM is available now and the 16GB RDIMM is scheduled for release Q2 09. For specific part numbers and ordering information, please see the table below. Additional product details are available at www.smartm.com.
P/N Speed Density Height Config. DRAM Config.
SG5722G4AH8P0PH PC3-10600 16GB 30mm 2Gx72 512Mx4
SG5721G4AH8P6PH PC3-10600 8GB 30mm 1Gx72 256Mx4
SG5721G4AH8P0PH1 PC3-10600 8GB 18.3mm 1Gx72 512Mx4
SG572124AH8P6PH1 PC3-10600 4GB 18.3mm 512Mx72 256Mx4
SMART Modular Technologies is a leading provider of memory products, offering more than 500 standard and custom products to top-tier OEMs in the computer, industrial, networking, and telecommunications sectors. Taking innovations from the design stage through manufacturing and delivery, SMART has developed a comprehensive memory product line that includes DRAM, SRAM, and Flash in various form factors. Through its subsidiary, Adtron Corporation, SMART offers high performance, high capacity solid-state drives for enterprise, defense/aerospace, industrial automation, medical, and transportation markets. SMART’s Display and Embedded Products Group designs, manufactures and sells thin film transistors (TFT) liquid crystal display (LCD) solutions to customers developing casino gaming systems as well as embedded applications such as kiosk, ATM, point-of-service, and industrial control systems. SMART’s presence in the US, Europe, Asia, and Latin America enables it to provide its customers with proven expertise in international logistics, asset management, and supply-chain management worldwide. More information on SMART can be obtained at www.smartm.com.