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  New Products  OpenVPX 3U Conduction Cooled 6 slot Portable Sealed Instrumentation Chassis
New Products

OpenVPX 3U Conduction Cooled 6 slot Portable Sealed Instrumentation Chassis

PCI-SYSTEMS Inc.PCI-SYSTEMS Inc.—September 2, 20100
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September 03, 2010 — PCI-SYSTEMS Inc. , a leading supplier of conduction cooled systems, today announced a OpenVPX Conduction Cooled Rugged armoured portable 6 slot chassis with many integrated functions, enabling accelerated development of rugged conduction cooled embedded systems.

• 6 Slots plus Power supply slot

• OpenVPX

• Modular Backplane

• GPS integrated

•1Hz GPS clock output available on backplane

• 3 axis shock sensor and chassis management FPGA integrated

• 8 lane per slot PCIe Gen2, Rapid I/O, Ethernet switches integrated

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The chassis is a OpenVPX COTS product for 3U VPX instrumentation and can be used for multiple applications by changing the switch mezzanine to customer needs. PCIe Gen 2 “noStub” routing is used throughout the system to maximize data throughput.

Also it is possible to use a Gb Ethernet switch and a serial Rapid I/O switch on this mezzanine, if needed. On this mezzanine card a 3 axis shock sensor IC is integrated and the values can be read over a I2C bus which is connected to all applicable slots as per VITA specification. The rear I/O PCB is equipped with connectors (MIL-C-38999 series 3) and also holds a GPS module that can be connected to an active or passive antenna. The GPS module is connected to serial ports on the switch mezzanine through PCIe and does not need any other serial port in the system. A GPS 1Hz clock from this module is connected to the appropriate pins on the VPX slots.

High speed ERNI 10Gig connectors connect the backplane and the mezzanine cards and all active components are conduction cooled. The backplane and the mezzanine cards are held in place using a special rubber type insert, therefore it dampens the backplane/mezzanine assembly against vibrations. The cards do not experience stress on the connectors as it is usually the case in traditional backplanes which are screwed down at different points and apply stress during assembly, during wedgelock screw down and during extended temperature ranges as well as shock and vibration to all parts on those PCBs. The chassis is chromatized on all surfaces before applying custom primary and secondary coatings. EMI is therefore minimized and can be further minimized by using SSC on all slots in the system. Repair time is very short because the outside metal armor is screwed to the chassis and the chassis itself can be opened on top, the backplane assembly is removed and reinserted very quickly, no screws are used.

PCI-SYSTEMS Inc. develops and manufactures intelligent CPU and peripheral boards as well as advanced mechanical design solutions in the US and Germany for many platforms that provide precision control of robotic and automated equipment in the semiconductor, medical and industrial equipment markets as well as for ruggedized embedded OEM applications in airborne and defense applications.

Contact:

Usa

PCI-Systems Inc.

Tel. 301-358-3621

Europe

PCI embedded computer systems GmbH

Germany Tel: 49-0-6074-35108

Please enquire to [email protected]

Website www.pcisystems.com

Except for the historical information contained herein, the matters discussed in this press release are forward-looking statements made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These statements involve risks and uncertainties, such as quarterly fluctuations in operating results, the timely availability of new products, the impact of competitive products and pricing, and other risks. These risks and uncertainties could cause actual results to differ materially from any forward-looking statements made in this press release

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