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| 3U conduction cooled VPX development chassis |
PCI-SYSTEMS Inc. , a leading supplier of conduction cooled systems, today announced a NEW VPX Conduction Cooled Rugged DEVELOPMENT KIT, enabling accelerated development of rugged conduction cooled embedded systems.
VPX versions are available with a PCIexpress bus implementation on the backplane, having 8 lanes per slot and a 64 lane switch, therefore allowing up to 7 add-on slots and a CPU slot for very high bandwidth computing applications.
CompactPCI Express Type 3 and CompactPCI backplanes with rear I/O are available as an option.
PCI Systems unique VPX switch solution allows easy customization of backplane topology. Custom fabric implementation, like full mesh are available per request.
The standard rugged conduction cooled power supply can provide up to 250 watts. It has a 12-36VDC (28VDC nominal) power input requirement.
Output voltages of +/-12V, +5V and +3.3V are standard.
An external AC adapter is provided for development use. The same power supply board may be used in all available backplane options.
The chassis is manufactured from aluminum to guarantee maximum ruggedness at minimum weight.
Power dissipation of the installed boards and power supply is by conduction cooling through the walls of the chassis and cooling fins.
The chassis can then be externally air cooled or mounted to a larger external chassis as a heat sink.
Boards are fixed in place with Wedge-Loks ® (1) to insure good heat conduction to the chassis and vibration control.
PCI-SYSTEMS Inc. develops and manufactures intelligent CPU and peripheral boards as well as advanced mechanical design solutions in the US and Germany for many platforms that provide precision control of robotic and automated equipment in the semiconductor, medical and industrial equipment markets as well as for ruggedized embedded OEM applications in airborne and defense applications.