TEWS extends its tradition of delivering high-density and high-performance serial communication solutions with the introduction of the TIP360. The new Quad Integrated Communication IndustryPack module is based on the Motorola MC68360 Processor running at 25 MHz and designed for data communications, process control, aerospace/defense communications, and traffic control applications.
The MC68360 features a CPU32 core processor, a micro coded RISC communication processor, 14 serial DMA channels, two independent DMAs, 4 general purpose timers, an interrupt controller, 4 independent full-duplex serial communication controllers (SCCs), two Serial Management Controllers (SMCs) and 2.5 kbytes Dual-Port of internal RAM.
The TIP360 offers TTL level interface for all 4 SCCs of the MC68360 at the IndustryPack I/O connector. A variety of physical layer standards, such as RS232, RS422, RS485, ISDN or IEEE802.3/Ethernet can be supported by the use of custom transition modules.
Internal microcode in the MC68360 provides a variety of protocols, such as BISYNC, HDLC, SDLC, UART, DDCMP, AppleTalk, Signaling System #7, Profibus, ATM, V.14, X.21, ISDN and totally transparent modes.
In addition to the internal RAM, the TIP360 provides 256 KB of SRAM, 256 KB of Flash memory, 2 MB of “DRAM” (realized with SRAM and onboard logic to maintain exiting 68360 board configuration) as dual-port memory. SRAM or Flash memory is selectable as boot memory by switching a control register. The code is downloaded to the SRAM or Flash memory by the IndustryPack host CPU prior to removing the MC68360 reset signal by writing to a control register. Once the MC68360 reset signal is removed, the MC68360 starts fetching code from boot memory.
The SRAM, Flash memory, DRAM, MC68360 registers and MC68360 on-chip RAM are accessible by the MC68360 and the IndustryPack host CPU by arbitration. The local bus arbitration is transparent to the IndustryPack host CPU. Both the IndustryPack host CPU and the MC68360 are capable of generating interrupts to each other.
The TIP360 operates from -40 to +85C. In order to support long term programs, the new module has a 5 year warranty.
About TEWS TECHNOLOGIES
TEWS TECHNOLOGIES is a leading solutions provider of embedded I/O and CPU products based on open architecture standards such as PMC, IndustryPack® (IP), CompactPCI, standard PCI, and VME. TEWS has more than 30 years of experience designing and building turn-key embedded interface solutions using the philosophy to listen and respond to our customers needs. Using this ‘customer first approach, TEWS has developed a large number of standard and custom products for applications in industrial control, telecommunication infrastructure, medical equipment, traffic control and aerospace/defense. TEWS line of embedded I/O solutions is available worldwide through a global network of distributors. For more information, go to www.tews.com.