VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  STMicroelectronics Announces World’s First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers
New Products

STMicroelectronics Announces World’s First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers

STMicroelectronicsSTMicroelectronics—February 22, 20100
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

Geneva, February 22, 2010 – STMicroelectronics (NYSE: STM), a top semiconductor supplier to the automotive industry, today announced its 55 nanometer (nm) embedded Flash (eFlash) process technology, which will be implemented in its next-generation automotive microcontroller (MCU) chips. ST is extending its production of eFlash technology to this advanced process node at its world-class 300mm manufacturing facility at Crolles, France.

More stories

Pentek’s New QuartzXM SoM Speeds Custom Deployment of RFSoC in SWaP Critical Environments

August 20, 2018

Curtiss-Wright Controls’ New Low-Power VME SBC Upgrades Earlier SBCs with 6x Performance and Similar Cost

September 28, 2011

Atego releases Aonix Perc Ultra for VxWorks MILS 2.1

November 2, 2010

New Rugged GPGPU from Aitech Brings Exceptional Graphics Processing to Harsh Environments

November 4, 2013

The 55nm eFlash technology builds upon ST’s 20-year expertise in embedded Flash and is also the continuation of the company’s successful 90nm eFlash automotive microcontroller family. Automotive market demands are driving the technology beyond the performance currently delivered by 90nm-based chips. Next-generation automotive systems will increasingly require MCUs with more computational performance, better power efficiency and greater memory content to meet market requirements in automotive applications, such as functional safety, tougher emission standards or ADAS (Advanced Driver-Assistance Systems) solutions. The new technology will enable ST to provide substantial performance improvement and greater value to its customers and will be the basis for ST’s future Automotive 32-bit Power Architecture™-based MCU roadmap.

ST’s eFlash technology has been developed, and also will be manufactured, at the company’s Crolles facility, which is automotive certified and is the world’s leading manufacturing site for 55nm eFlash. Same-site development and manufacturing means ST can deliver high process stability and exceptionally high levels of quality, in addition to long-term availability. At Crolles, ST is in production with 55nm technology for automotive products and has already produced several fully working embedded Flash technology test vehicles implementing key automotive system IP.

“Embedded Flash is an absolutely critical technology in a chip maker’s arsenal to deliver cutting-edge System-on-Chip ICs for automotive applications,” said Marco Monti, General Manager of ST’s Automotive Electronics Division. “Both the development and manufacturing at our Crolles site will ensure the high quality and adequate supply for our automotive customers.”

ST’s first MCU products to implement the 55nm eFlash technology are expected to target automotive applications, including engine management and transmission, car body controllers and safety/ADAS. First 55nm embedded-Flash product is expected to be available for customer sampling in mid-2011, and automotive qualification in 2013.

About STMicroelectronics

STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the Company’s net revenues were $8.51 billion. Further information on ST can be found at www.st.com.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
New Parametric Handbook Simplifies Parametric Measurement.
ISD860: Cost-effective Intelligent Servo Drive Exploits the Power of TML
Related posts
  • Related posts
  • More from author
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Load more
Read also
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.