VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  New X6-250M
New Products

New X6-250M

X-ESX-ES—August 1, 20120
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail



Innovative Integration, Simi Valley, CA , July 25, 2012 announces the new X6-250M. The X6-250M integrates digitizing with signal processing on a PMC/XMC IO module. The module has a powerful Xilinx Virtex 6 FPGA signal processing core, and high performance PCI Express/PCI host interface. Applications include software-defined radio, RADAR receivers, and multi-channel data recorders.

More stories

Galleon Embedded Computing Announces rugged Titan Quad 10 Gigabit Ethernet XMC

February 12, 2015

VME Board Combines VXS I/O with Dual 215 MHz ADCs and FPGAs for On-Board Signal Processing

November 15, 2004

AIM-USA Develops MILScope

August 25, 2009

Amphenol Aerospace Enhances Rugged 2M Series Connector for Military/Industrial Applications

February 1, 2013

The X6-250M has eight simultaneously sampling A/D channels that sample at rates up to 310 MSPS (14-bit). The A/D have matched input delays and response. The A/D are supported by a programmable sample clock PLL and triggering that support multi-card synchronization for large scale systems.

A Xilinx Virtex6 SX315T (LX240T and SX475T options) with 4 banks of 1GB DRAM provide a very high performance DSP core with over 2000 MACs (SX315T). The close integration of the analog IO, memory and host interface with the FPGA enables real-time signal processing at extremely high rates.

The X6-250M has both XMC and PCI interfaces, supporting PCI Express or older PCI systems. The PCI Express interface provides up to 3.2 GB/s sustained transfers rates through a x8 PCIe Gen2 interface. System expansion is supported using secondary PCI Express or Aurora port used as a private data channel or second system bus.

The X6-250M power consumption is 23W for typical operation. The module may be conduction cooled using VITA20 standard and a heat spreading plate. Ruggedization levels for wide-temperature operation from -40 to +85C operation (conformal coating) and 0.1 g2/Hz vibration.

The FPGA logic can be fully customized using VHDL, Matlab and the Frame Work Logic tool set. The Matlab Board Support Package (BSP) supports real-time hardware-in-the-loop development using the graphical block diagram Simulink environment with Xilinx System Generator. IP cores for many wireless and DSP functions such as DDC, PSK/FSK demod, OFDM receiver, correlators and large FFT are available. Software tools for host development include C++ libraries and drivers for Windows and Linux (including realtime variants). Application examples demonstrating the module features are provided.

This extremely versatile module is easily adapted for use in virtually any type of system. Our XMC carrier adapters offer conduction and convection cooling and are available for a range of interfaces including desktop PCI/PCI-Express, cabled PCI-Express, CompactPCI, and PXI. This module is also readily installed into Innovative Integration’s Instrument Embedded PC and Andale Data Loggers. X6-250M may also be adapted to our VPXI-ePC for remote, autonomous IO, mobile instrumentation, distributed data acquisition or signal processing clusters.

Innovative Integration is a leader in signal processing and data acquisition hardware and software. Our products combine DSPs and FPGAs with high performance analog, ready for integration into demanding realtime applications such as wireless, medical, and military. Engineered in the USA. Manufactured in the USA by our parent company, Interconnect Systems, Inc: www.isipkg.com. To learn more, visit www.innovative-dsp.com. Press picture: www.innovative-dsp.com/ftp/Marketing/Photos/X6-[…]

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
ISI Delivers Molded Multi-Component Modules for Miniaturized, Rugged Applications
Comparing Network Appliance Throughput Across 2nd Generations of Intel Core Platforms – Live Event: August 8, 2012 (2:00 p.m. EDT/11:00 a.m. PT)
Related posts
  • Related posts
  • More from author
Eletter Products

SPONSORED: Rugged 1/2 ATR Aligned to SOSA, CMFF and SAVE Ready

January 30, 20250
Consortia and Working Groups

Call for Consensus Body Members to Reaffirm ANSI/VITA 67.1-2019 – Coaxial Interconnect on VPX, 4 Position SMPM Configuration

January 28, 20250
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

January 28, 20250
Load more
Read also
Eletter Products

SPONSORED: Rugged 1/2 ATR Aligned to SOSA, CMFF and SAVE Ready

January 30, 20250
Consortia and Working Groups

Call for Consensus Body Members to Reaffirm ANSI/VITA 67.1-2019 – Coaxial Interconnect on VPX, 4 Position SMPM Configuration

January 28, 20250
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

January 28, 20250
Eletter Products

SPONSORED: Introducing AirBorn’s 2300W+ VPX Power Supply

January 28, 20250
Consortia and Working Groups

VITA announces formation of VITA 100 working groups

January 13, 20250
Articles

VITA Technologies 2025 Application Guide is here!

December 13, 20240
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.