VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  TE Connectivity Introduces Versatile, Cost-effective M.2 (ngff) Connectors For Smaller, Lighter And Thinner Computing Devices
New Products

TE Connectivity Introduces Versatile, Cost-effective M.2 (ngff) Connectors For Smaller, Lighter And Thinner Computing Devices

TE ConnectivityTE Connectivity—June 12, 20130
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

TE Connectivity (TE) launched a line of M.2 next-generation form factor (NGFF) connectors, which are designed using the new interface standard for a smaller form factor in both size and volume. Engineered for a wide range of applications, including SSDs (solid state drives) and wireless cards of all types for use in notebooks, ultraportable devices, tablets, desktops and servers, TE’s M.2 (NGFF) products meet both current and future market needs for slim solutions.

TE is at the forefront of evolving markets that need miniaturized connectors to maximize printed circuit board (PCB) real estate, reduce profile height and support higher data rates. They designed two M.2 (NGFF) product types having a standard top PCB mount or a midplane (offset) PCB mount. The M.2 connectors are designed in a dense form factor of just 0.5mm pitch with 67 positions.

“As the market shifts toward slimmer solutions, we see M.2 (NGFF) products as the natural transition from the PCI Express Mini Card to a smaller, standardized form factor,” said Jaren May, global product manager of TE Consumer Devices. “As M.2 (NGFF) connectors are in the early phase of their product lifecycle, we’re working with industry standard committees, as well as other innovative companies, to lead the market towards slimmer designs.”

TE’s M.2 (NGFF) product portfolio offers industry-leading features and benefits, including:

· Provides a range of profile heights

More stories

First Single-slot 3U VPX Quad-head Graphics Display Controller Introduced By Curtiss-wright

August 31, 2015

New ATS Heat Sinks Feature Push Pin Mounting

July 19, 2011

ON Semiconductor Launches GreenPoint(r) Interactive Online Design Simulation Tool

September 30, 2010

First In New Family of I/O Boards From GE Intelligent Platforms Significantly Enhances Functional Density

September 28, 2010

· Supports enhanced data rates, which include PCI Express 3.0, SATA 3.0 and USB 3.0

· Saves more than 20 percent of PCB real estate

· Reduces connector height by 15 percent (as compared to PCI Express Mini Card connectors)

· Ensures proper mating configurations with module cards through several keying options

· Accepts both single- and double-sided modules

“Innovating a high-performing, small-scale M.2 (NGFF) connector with a cost-effective design was a challenge that our team of design engineers successfully met,” said May.

Visit TE slim solutions website for additional information, including the M.2 (NGFF)product and application specifications and 3D models, as well as customer drawings, among other resources: www.te.com/products/ngff-pr.

About Te Connectivity

TE Connectivity (NYSE: TEL) is a $13 billion world leader in connectivity. The company designs and manufactures products at the heart of electronic connections for the world’s leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity’s long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in over 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day. To connect with the company, visit: www.TE.com.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Curtiss-Wright Controls Awarded Contract by BAE Systems
Mercury Systems Awarded Superior Security Rating by U.S. Defense Security Service
Related posts
  • Related posts
  • More from author
Articles

VITA Hall of Fame

December 1, 20250
Articles

Designing with QMC

December 1, 20250
Articles

VITA standards activity updates

December 1, 20250
Load more
Read also
Articles

VITA Hall of Fame

December 1, 20250
Articles

Designing with QMC

December 1, 20250
Articles

VITA standards activity updates

December 1, 20250
Articles

Leveraging AI in standards

December 1, 20250
SOSA Aligned Chassis Management from Development to Deployment
Eletter Products

SPONSORED: VPX Chassis Management – US Made, Open Source In-field Code Upgrades

November 25, 20250
Eletter Products

SPONSORED: Advanced SBC powered by NVIDIA® Jetson AGX Orin™ Industrial

November 24, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.