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L-3 Cincinnati Electronics Selects Cypress to Manufacture Readout Integrated Circuits for Thermal Imaging Applications
Cypress Foundry Solutions Chosen for High-Yield SONOS Process Technology Expertise in “Stitching” Oversized Dice from Wafers
SAN JOSE, Calif. and MASON, Ohio, January 22, 2014 – Cypress Semiconductor Corp. (NASDAQ: CY) today announced it has been selected by L-3 Cincinnati Electronics, a division of L-3 Communications (NYSE: LLL), as a supply partner to manufacture its Readout Integrated Circuits (ROICs). L-3 CE will design and manufacture its state-of-the-art ROICs for its cooled infrared detectors using Cypress’s proprietary process technology at the Cypress Foundry Solutions wafer fabrication facility in Bloomington, Minnesota. L-3 CE selected Cypress based on the potential for significant manufacturing yield enhancements for large-die ROIC devices.
The ROICs will be based on Cypress’s S8™ mixed-signal 130-nanometer flash-based SONOS (Silicon Oxide Nitride Oxide Silicon) process technology. SONOS is compatible with standard CMOS technologies and offers numerous advantages, including high endurance and low power.
Due to the large die size of infrared sensor ROICs, L-3 CE looked for a manufacturing partner that could provide the lowest percentage of defects for higher yield. L-3 CE also wanted a partner with proven expertise in “stitching,” or the ability to process dice larger than standard stepper wafer handling equipment can handle. Cypress meets these requirements by combining its 130-nm mixed-signal front-end process with the low-defect density and design rules for precise stitching of its 90-nm aluminum back-end of line process.
“Based on Cypress’s comprehensive defect control strategy, we are pleased to expand our supplier base to meet the growing demand for large-format thermal imaging,” said Vance King, Vice President and General Manager of IR Products at L-3 Cincinnati Electronics. “Our cutting-edge, high-definition sensing technology, combined with Cypress’s proven, high-volume 8-inch 130-nm technology and manufacturing expertise, enables us to achieve the performance and affordable cost requirements of U.S. defense markets.”
“This agreement continues to validate Cypress’s commitment to high-quality, low-cost manufacturing in the United States,” said Mehran Sedigh, Vice President of Front-End Manufacturing at Cypress. “We have continued to expand our base of leading-edge customers, such as L-3, for our Minnesota wafer fab, and we expect this trend to continue as more companies see the value and service that Cypress Foundry Solutions offers.”
The agreement will leverage Cypress’s advanced process technology and transfer expertise along with its Trusted Fab accreditation and quality certifications for TS16949 and ISO14001. L-3 CE and Cypress expect to have the product qualified by late 2014.
Cypress manufactures high-performance, mixed-signal, programmable solutions for a variety of markets, including defense and automotive, proving a strong fit for L-3 CE, a leader in infrared solutions for military and commercial applications.