As you know, we are working on 3 cooling technology standards in the VSO. Many of the packaging companies are embarking on new liquid-cooling techniques. Another company in VITA has developed new air-cooling technology. Another member has developed spray-cooling techniques used in some Military programs. Others are liquid-cooling ATR boxes containing conduction-cooled VME cards (a hybrid). And, we have members who sell and use cold-plates for cooling both chips and boards with liquids. Other members have developed liquid-flow-through chassis techniques (seen at B&B in January).
As you can see from the information below, the market for cooling solutions at the chip, board, and chassis level is large and growing rapidly. Our thermal challenges will only get worse before they get any better. So, I hope this information will help you define and decide your future cooling options and opportunities.
Thermal Management Sales Forecast
(Worldwide, in Millions of US Dollars, by application)
|
Segment
|
2003
|
2008
|
%growth 03-08
|
|
Computers |
1,332 |
2,291 |
11.5% |
|
Telecom |
804 |
1,131 |
7.1% |
|
Automotive |
216 |
523 |
19.3% |
|
Consumer |
170 |
397 |
18.6% |
|
Medical/Office equip |
331 |
648 |
14.4% |
|
Indust/Military |
472 |
896 |
13.7% |
|
Total |
3,325 |
5,886 |
12.1% |
As you can see, the advanced cooling techniques are being adopted by many market segments, some more than others, and we are working on those technologies in VITA to standardize some of the aspects to make them compatible with all members’ products, and guarantee inter-mateability and inter-operability where it’s needed.
Regards..Ray Alderman
