VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  Industry News  Technical Overview of TI Multicore Solutions for High-Density Applications Live Event: November 5, 11:00 AM EDT
Industry News

Technical Overview of TI Multicore Solutions for High-Density Applications Live Event: November 5, 11:00 AM EDT

Texas Instruments and Virtual LogixTexas Instruments and Virtual Logix—October 21, 20080
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

This E-cast will also cover the latest high-performance multicore DSP from TI, the three-core TMS320C6474 including AIF and SRIO, and optimized for multichannel and multi-function performance hungry applications. TI will provide a preview of their next multicore solution slated for First Quarter 2009.

Company participants will be available for a Q&A session immediately following the E-cast.

• Who: Technologists from Texas Instruments and

Virtual Logix

• What:Industry experts from Texas Instruments

and Virtual Logix,and OpenSystems Media

More stories

Ballard Technology Introduces MIL-STD-1553 PrPMC

November 8, 2007

Acromag celebrates 50th Anniversary

August 20, 2007

Tews Technologies Introduces Extended Temperature and High-Density Full/Half Duplex Serial Communication PMC Module

August 1, 2007

Silicon Sense first to achieve EPA approval to import detonation nanodiamonds to US

November 27, 2017

to present a live OpenSystems Media

E-cast,“Technical Overview of TI

Multicore Solutions for High-Density

Applications”

• When:Wednesday, Nov. 5, 2008 at 11:00 a.m. EST

• Where: To attend the E-cast, participants can

register at:

ecast.opensystemsmedia.com/

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: CompactPCI and AdvancedTCA Systems, DSP-FPGA.com, Embedded Computing Design, Industrial Embedded Systems, Military Embedded Systems, PC/104 and Small Form Factors, and VME and Critical Systems. For more information, visit www.opensystemsmedia.com.

###

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Artisan announces Early Availability Program for Artisan GSN Modeler
Power Architecture® Extends Market Leadership and Excels in Diverse Range of Applications
Related posts
  • Related posts
  • More from author
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Articles

VITA Hall of Fame

December 1, 20250
Articles

Designing with QMC

December 1, 20250
Load more
Read also
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Articles

VITA Hall of Fame

December 1, 20250
Articles

Designing with QMC

December 1, 20250
Articles

VITA standards activity updates

December 1, 20250
Articles

Leveraging AI in standards

December 1, 20250
SOSA Aligned Chassis Management from Development to Deployment
Eletter Products

SPONSORED: VPX Chassis Management – US Made, Open Source In-field Code Upgrades

November 25, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.