VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  Industry News  Technical Overview of TI Multicore Solutions for High-Density Applications Live Event: November 5, 11:00 AM EDT
Industry News

Technical Overview of TI Multicore Solutions for High-Density Applications Live Event: November 5, 11:00 AM EDT

Texas Instruments and Virtual LogixTexas Instruments and Virtual Logix—October 21, 20080
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

This E-cast will also cover the latest high-performance multicore DSP from TI, the three-core TMS320C6474 including AIF and SRIO, and optimized for multichannel and multi-function performance hungry applications. TI will provide a preview of their next multicore solution slated for First Quarter 2009.

Company participants will be available for a Q&A session immediately following the E-cast.

• Who: Technologists from Texas Instruments and

Virtual Logix

• What:Industry experts from Texas Instruments

and Virtual Logix,and OpenSystems Media

More stories

GAO Launches Its Active RFID Jumbo Tag

January 15, 2009

WiMAX, ZigBee, UWB and Wireless LAN Tutorials Come to GSPx 2005

August 30, 2005

One Stop Systems Introduces Industry-First PCI Express SuperSwitch for Host-to-Host Communication

November 6, 2007

Aonix PERC Ultra Virtual Machine passes muster on modernized guided missile cruiser USS Bunker Hill

March 29, 2010

to present a live OpenSystems Media

E-cast,“Technical Overview of TI

Multicore Solutions for High-Density

Applications”

• When:Wednesday, Nov. 5, 2008 at 11:00 a.m. EST

• Where: To attend the E-cast, participants can

register at:

ecast.opensystemsmedia.com/

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: CompactPCI and AdvancedTCA Systems, DSP-FPGA.com, Embedded Computing Design, Industrial Embedded Systems, Military Embedded Systems, PC/104 and Small Form Factors, and VME and Critical Systems. For more information, visit www.opensystemsmedia.com.

###

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Artisan announces Early Availability Program for Artisan GSN Modeler
Power Architecture® Extends Market Leadership and Excels in Diverse Range of Applications
Related posts
  • Related posts
  • More from author
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more
Read also
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.