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  Industry News  Technical Overview of TI Multicore Solutions for High-Density Applications Live Event: November 5, 11:00 AM EDT
Industry News

Technical Overview of TI Multicore Solutions for High-Density Applications Live Event: November 5, 11:00 AM EDT

Texas Instruments and Virtual LogixTexas Instruments and Virtual Logix—October 21, 20080
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This E-cast will also cover the latest high-performance multicore DSP from TI, the three-core TMS320C6474 including AIF and SRIO, and optimized for multichannel and multi-function performance hungry applications. TI will provide a preview of their next multicore solution slated for First Quarter 2009.

Company participants will be available for a Q&A session immediately following the E-cast.

• Who: Technologists from Texas Instruments and

Virtual Logix

• What:Industry experts from Texas Instruments

and Virtual Logix,and OpenSystems Media

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to present a live OpenSystems Media

E-cast,“Technical Overview of TI

Multicore Solutions for High-Density

Applications”

• When:Wednesday, Nov. 5, 2008 at 11:00 a.m. EST

• Where: To attend the E-cast, participants can

register at:

ecast.opensystemsmedia.com/

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: CompactPCI and AdvancedTCA Systems, DSP-FPGA.com, Embedded Computing Design, Industrial Embedded Systems, Military Embedded Systems, PC/104 and Small Form Factors, and VME and Critical Systems. For more information, visit www.opensystemsmedia.com.

###

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