Rugged COM Express® or VITA 59 is a new standard which is based on the proven PICMG COM Express® standard. Due to mechanical modifications, the modules are now also able to meet the high requirements of critical markets regarding temperature, shock and vibration, EMC compatibility and resistance against dust and humidity.
The Intel® Core™ i7 processor family with a core frequency of up to 2.1 GHz and a Turbo Boost frequency of 3.1 GHz makes it possible to choose between 1, 2 or 4 processor cores. As many as 16 GB DDR3 DRAM are soldered to the board. In addition, Intel® AMT, Open CL 1.1 and high-end graphics are supported.
The adaptable BIOS with integrated Intel® AMT support can be flexibly adapted to the final application without additional costs. The Board Management Controller supervises the board functions and temperatures.
I/O interfaces of the CB70C include PCI Express®, LVDS, DDI, VGA, HD Audio, SATA, Ethernet and USB. As the CB70C is embedded in an aluminum frame for conduction cooling specified according to the VITA 59 standard, it can be used in the extended temperature range of -40 to +85°C. Due to the soldered components and the compact frame, the module is also protected against shock and vibration and is EMC proof.
The dimensions of the CB70C Rugged COM Express® module are a bit larger than those of a standard COM Express® Basic module with pin-out type 6, as it is equipped with additional small wings on the sides to ensure thermal connection to the aluminum frame in which it is embedded. The new module is also available without these wings as a standard COM Express® module according to PICMG COM.0 and then named CB70.
