VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  Conferences and Awards  Rockwell Collins hosting FACE Consortium meeting
Conferences and Awards

Rockwell Collins hosting FACE Consortium meeting

Rockwell CollinsRockwell Collins—May 23, 20140
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

CEDAR RAPIDS, Iowa (May 23, 2014) – Rockwell Collins, a leader in developing open systems architecture avionics solutions, will host the June 3-5 meeting of the Future Airborne Capability Environment (FACE™) Consortium at its corporate headquarters in Cedar Rapids. The FACE Consortium is a government and industry partnership working to develop standards for a common operating environment to support portable capability applications across multiple avionics systems.

More stories

ON Semiconductor Receives Trusted Foundry and Broker Accreditations

January 17, 2012

Fused Driver Vision Enhancement solution to be launched on Stand 395 at Eurosatory in Paris (16-20 June 2014)

June 9, 2014

Keeping your social distance

April 20, 2020

TE Connectivity Named A Thomson Reuters 2014 Top 100 Global Innovator For Fourth Consecutive Year

November 13, 2014

“As a founding sponsor of the FACE Consortium, Rockwell Collins is looking forward to hosting members while they do the important work of codifying open architecture standards for defense avionics,” said Troy Brunk, vice president and general manager of Airborne Solutions for Rockwell Collins. “In a constrained military budget environment, industry and government must work together aggressively to reduce costs while shortening the time to bring new technologies to the warfighter.”

The FACE Consortium publishes technical standards that specify the software architecture and how avionics applications communicate and interact. At this meeting, members will continue developing concepts for Edition 3.0 of the FACE Technical Standard, building upon the foundations now in place from previously published editions. Members will also continue to evolve the business strategy, including finalizing FACE conformance certification and software library operations, to promote and ensure successful adoption of the FACE Technical Standard.

The FACE Consortium was formed in 2010 as a government and industry partnership to define an open avionics environment for all military airborne platform types. Today, it is an aviation-focused professional group made up of more than 70 industry suppliers, customers, academia and users. The FACE Consortium provides a vendor-neutral forum for industry and government to work together to develop and consolidate the open standards, best practices, guidance documents and business strategy necessary for acquisition of affordable software systems that promote innovation and rapid integration of portable capabilities across global defense programs.

About Rockwell Collins

Rockwell Collins is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications. Our expertise in flight deck avionics, cabin electronics, mission communications, simulation and training, and information management services is delivered by a global workforce, and a service and support network that crosses more than 150 countries. To find out more, please visit www.rockwellcollins.com.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Curtiss-Wright Expands Defense Solutions Division
Aetina to Exhibit Industrial/Embedded Oriented VGA and GPU Solutions at Computex 2014
Related posts
  • Related posts
  • More from author
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Load more
Read also
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.