Deployment in scalable subsystems right to the tactical edge

Taking the server on 3U VPX a step further, Mercury Systems is adding a Xilinx FPGA. The rugged OpenVPX Ensemble LDS3506 processing module integrates an Intel Xeon processor D system-on-chip (SoC) with Xilinx’s UltraScale FPGA in a size, weight, and power (SWaP)-constrained 3U package. This dense union of best available commercial item general processing and FPGA resources produces a highly versatile, affordable, and interoperable building block for embedded, high-performance computing applications with additional low-latency, refresh, and mission capabilities. The Ensemble LDS3506 leverages Mercury’s fourth generation of highly SWaP-efficient packaging technology to securely deliver the Intel Xeon processor D product family for reliable deployment in scalable subsystems right to the tactical edge. The Ensemble LDS3506 is a dense, powerful combination of general server-class and low-latency front-end FPGA processing in an open systems architecture module. “With over 256 peak GFLOPS of general processing power from the Intel processor alone, the Ensemble LDS3506 represents a disruptive force in the 3U embedded market space,” said Ian Dunn, VP of Mercury Systems’ Embedded Products group. “It is the unique combination of this latest Intel technology combined with the low-latency and versatile FPGA resources that delivers a potent compute solution for multidimensional SWaP-constrained applications, particularly those that are sensitive to performance and latency, such as electronic warfare (EW), electro-optical/infrared (EO/IR), image intelligence (IMINT), and other mission or sensor processing applications.”