VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  TE Connectivity Introduces Half-Size VITA 66.4 Module for Embedded Computing
New Products

TE Connectivity Introduces Half-Size VITA 66.4 Module for Embedded Computing

TE ConnectivityTE Connectivity—July 20, 20160
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

HARRISBURG, Pa. – July 20, 2016 –TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.

“As the industry expands its use of fiber optic solutions in higher bandwidth applications, TE continues to support the VMEbus Industry Trade Association (VITA) in the rugged embedding computing market,” said Rod Smith, global product line manager, Global Aerospace, Defense & Marine, TE Connectivity. “The VITA 66.4 platform is the latest innovation to enable fiber optic solutions for harsh environments.”

The new fiber optic ribbon cable interconnect feeds through the backplane to removable system modules using MT ferrules. The VITA 66.1 modules are full width and accommodate two MT ferrules, and the VITA 66.4 modules are half width and hold a single MT ferrule. Two VITA 66.4 modules can fit into the same space as a VITA 66.1 module.

Designed for rugged embedded computing applications, the optical modules are compatible with VPX and other high-performance standards. The protective cover is made of anti-static material, and the connector mounting screws contain a pre-applied anti-vibration material to help withstand vibration. The modules have an operating temperature range of minus 20 degrees Celsius to 85 degrees Celsius and can withstand 100 cycles, as tested per EIA-455-21.

For more information on TE’s Ruggedized Optical Backplane interconnect system, contact the Product Information Center at 1-800-522-6752 or visit te.com/vita66.

Learn more about TE’s advanced connectivity solutions for the Aerospace, Defense and Marine industries.

TE, TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product and/or company names might be trademarks of their respective owners.

More stories

Pentek Introduces New PMC/XMC Transceiver Module Ideal for Wideband Radar Countermeasures and MIL/COTS Applications

September 8, 2009

Inphi samples first JEDEC-compatible memory buffer that enables a new-class of memory modules — load-reduced DIMMs

January 20, 2010

New Lanner Enterprise-Class Network Appliance Maximizes Ethernet Port Density and Network Bandwidth by Utilizing the Intel(r) Xeon(r) Processor C5500 Series and Intel(r) 3420 Chipset

February 10, 2010

Curtiss-Wright Controls Introduces Dual Mezzanine Card Subsystem

August 31, 2010

About Te Connectivity

TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS – www.TE.com.

Contacts:

Todd Scott

+1-717-652-0100 x190

[email protected]

Claudia Wiedmann

+49 162 2066266

[email protected]

Dale F. Reeves

+1-717-986-7316

[email protected]

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Wireless Charging Market strengthen its Root Due to Rise in electrical vehicles manufacturing
Smart Battery Market Expands With Growing Popularity of Internet of Things (IoT)
Related posts
  • Related posts
  • More from author
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

May 28, 20250
Eletter Products

SPONSORED: Mission-Ready Chassis Management Aligned to SOSA®

May 28, 20250
Eletter Products

SPONSORED: 2300W Intelligent VPX Power Supply

May 21, 20250
Load more
Read also
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

May 28, 20250
Eletter Products

SPONSORED: Mission-Ready Chassis Management Aligned to SOSA®

May 28, 20250
Eletter Products

SPONSORED: 2300W Intelligent VPX Power Supply

May 21, 20250
Eletter Products

SPONSORED: Small Scale 4 Slot OpenVPX and SOSA Aligned System Development

May 21, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

May 14, 20250
Eletter Products

SPONSORED: Rugged 1/2 ATR Aligned to SOSA, CMFF and SAVE Ready

January 30, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.