VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  Industry News  Annapolis Micro Systems Adds Underfill Capability to Bolster Ruggedness and Security
Industry News

Annapolis Micro Systems Adds Underfill Capability to Bolster Ruggedness and Security

Annapolis Micro SystemsAnnapolis Micro Systems—August 4, 20160
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

Annapolis Micro Systems recently added a new, cutting-edge Underfill Application System to its state-of-the-art Surface Mount PCB production facility. The System is accurate to within ±0.025mm and is optimized for underfill, dam & fill, and COB encapsulation applications.

More stories

Curtiss-Wright’s New Rugged Low-Power Quad-Core VME DSP Engine Delivers 64 GFLOPS Performance

December 20, 2007

GE Fanuc Intelligent Platforms Announces World’s First COTS VXS Serial RapidIO Managed Switch

November 27, 2007

Aldec Enhances Entire EDA Suite with Key Verification Methodologies

February 27, 2009

Digia Extends Qt Commercial Primary Platform Support to Include QNX Neutrino RTOS

November 29, 2011

This underfill capability provides two advantages in PCB manufacturing: Ruggedness and Security. Both are important in the embedded COTS High Performance Computing market that Annapolis serves.

Underfill aids thermal ruggedness by transferring heat away from high-power chips, dulling thermal mismatching, and serving as an efficient coefficient of thermal expansion (CTE) absorber.

Resistance to shock and vibration is helped by the extra rigidity provided by the heat-cured underfill, thus protecting solder joints from mechanical stress.

For product security, underfill provides the system integrity, information assurance, and anti-tamper safeguards that defense and aerospace customers require. Underfill, combined with other measures, allows Annapolis to manufacture secure COTS boards and systems that protect customer data and equipment from being copied, manipulated, or reverse engineered.

The Underfill System joins a state-of-the-art manufacturing facility that is USA-based. Other leading-edge automation includes MYDATA Inventory Component Towers, Jet Solder Paste Printing, Solder Paste Inspection (SPI), Universal Instruments Pick-n-Place, Automated Optical Inspection (AOI), and Computerized Oven.

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Annapolis Micro Systems Adds Underfill Capability to Bolster Ruggedness and Security
Intelligent Electronic Devices Market Arises As Nations Worldwide Are Trying To Raise Electricity Production to comply with increasing industrialization
Related posts
  • Related posts
  • More from author
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Load more
Read also
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Articles

Leveraging AI in standards

June 3, 20250
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

May 28, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.