VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  Industry News  Annapolis Micro Systems Adds Underfill Capability to Bolster Ruggedness and Security
Industry News

Annapolis Micro Systems Adds Underfill Capability to Bolster Ruggedness and Security

Annapolis Micro SystemsAnnapolis Micro Systems—August 4, 20160
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

Annapolis Micro Systems recently added a new, cutting-edge Underfill Application System to its state-of-the-art Surface Mount PCB production facility. The System is accurate to within ±0.025mm and is optimized for underfill, dam & fill, and COB encapsulation applications.

More stories

VMETRO continues VPX momentum with addition of 3U VITA 46 FPGA Processing Engine

September 25, 2008

Actel Announces Compliance With Quality Management Standards SAE/AS9100 and ISO 9001

January 27, 2010

Pentek’s Quad 200 MHz, 16-bit A/D Data Converter Combined with Two Powerful Xilinx Virtex-5 FPGAs Delivers High-Speed, Enhanced Resolution and Extraordinary Processing Power

March 10, 2008

IMS Research – Healthy Growth Forecast for Embedded Computer Board Market

July 28, 2010

This underfill capability provides two advantages in PCB manufacturing: Ruggedness and Security. Both are important in the embedded COTS High Performance Computing market that Annapolis serves.

Underfill aids thermal ruggedness by transferring heat away from high-power chips, dulling thermal mismatching, and serving as an efficient coefficient of thermal expansion (CTE) absorber.

Resistance to shock and vibration is helped by the extra rigidity provided by the heat-cured underfill, thus protecting solder joints from mechanical stress.

For product security, underfill provides the system integrity, information assurance, and anti-tamper safeguards that defense and aerospace customers require. Underfill, combined with other measures, allows Annapolis to manufacture secure COTS boards and systems that protect customer data and equipment from being copied, manipulated, or reverse engineered.

The Underfill System joins a state-of-the-art manufacturing facility that is USA-based. Other leading-edge automation includes MYDATA Inventory Component Towers, Jet Solder Paste Printing, Solder Paste Inspection (SPI), Universal Instruments Pick-n-Place, Automated Optical Inspection (AOI), and Computerized Oven.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
IR Detector Market To Boost From Rising Demand of Security in Commercial Environments
Annapolis Micro Systems Adds Underfill Capability to Bolster Ruggedness and Security
Related posts
  • Related posts
  • More from author
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more
Read also
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.