VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  Eletter Products  Retain and Cool Your PCB in Harsh Environments
Eletter Products

Retain and Cool Your PCB in Harsh Environments

nVentnVent—November 20, 20180
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

nVent SCHROFF’s Conduction Cooled Assembly (CCA) is designed to retain and cool printed circuit boards in severe environments where convection cooling cannot be used. The CCA also provides needed structural support of a plug-in module when used in high-shock and vibration environments such as military and defense and commercial aerospace systems.

H84

More stories

New OpenVPX Innovations from Pixus Technologies

July 2, 2020

3U OpenVPX Backplanes – start with the innovation leader

December 6, 2016

OpenVPX Backplanes – where it all starts

July 10, 2017

XMC High Speed 32-channel Programmable Range 16-bit D/A

November 26, 2018

The CCA consists of a frame which features nVent SCHROFF High Performance Card Loks and tolerance compensating extractors to enhance performance. The High Clamp Force card loks improve clamp force three times better than standard card loks while still maintaining a small profile. Meanwhile, tolerance compensating extractors maintain positive pressure on connectors during installation and are ideal for maintenance in the field with a gloved hand.

heat-sink

SCHROFF’S CCA saves end users time and sourcing costs by allowing them to manage the entire assembly with one part number. Users can easily modify their CCA based on board layout and cooling needs. In addition, users have the ability to use full design services such as working with nVent engineers to overcome thermal dissipation challenges while meeting size and weight requirements. nVent also allows customers to download, pre-configured CAD templates that meet relevant standards from nVent’s website.

Contact:  Matt Haile [email protected]

nVent Logo

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
New SoM Speeds Custom RFSoC Deployment
First 100Gb-Capable 6U VPX FPGA Board, for High-Bandwidth Applications
Related posts
  • Related posts
  • More from author
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Load more
Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Read also
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.