VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  Peel-A-Way(r) Removable Terminal Carriers: High in Flexibility and Low in Profile
New Products

Peel-A-Way(r) Removable Terminal Carriers: High in Flexibility and Low in Profile

Advanced Interconnections Corp.Advanced Interconnections Corp.—November 12, 20090
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

Peel-A-Way® Removable Terminal Carriers:

High in Flexibility and Low in Profile

West Warwick, R.I., November 9, 2009 – For applications that require low profile and customizable PCB configurations, Peel-A-Way® Removable Terminal Carriers are the perfect solution for device socketing and board-to-board interconnect. Compared to traditional molded insulators, the ultra-thin, .005” (0.13mm) polyimide film carrier, employing near flush solder tail terminals (Type -210), reduces component height above the PC board by as much as 80%, down to .015” (0.38mm). For board-to-board applications, standard spacing options range from .045” (1.14mm) to .250” (6.35mm) with custom options available to suit virtually any application.

In-house carrier stamping and precision drilling enable fast turn-around on customized configurations including prototypes. Unique designs include zig zag, off pitch, special radius, circular, and patterns with multiple terminal/pin styles or cut-outs. Thousands of screw-machined socket and adapter terminals to choose from include tin/lead or lead-free plating as well as optional solder performs for mixed SMT/through-hole soldering environments. Peel-A-Way Removable Terminal Carriers allow virtually any pattern of sockets and/or pins to be combined on a single sheet for one-time PCB loading as compared to the costly and time consuming operation of discrete terminal placement (manual or automated stitching). The RoHS Compliant insulator is made from high temperature polyimide film and can be left in place after soldering for added stability or easily removed for full solder joint solder joint visibility, inspection and test.

Specific applications include socketing of relays, power devices (i.e. converters, transformers), temperature and process (i.e. flux) sensitive sensors, displays and other devices as well as applications in various industries including automotive, aerospace, computer and peripherals, industrial, instrumentation and test, medical, military, telecom and others. Standard configurations such as DIP, SIP, and PGA patterns are available with a 3-day lead-time.

More stories

Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes

September 14, 2009

Pentek Introduces Newest Multichannel, Virtex-7 Software Radio Module for UAV, Radar and Communications Applications

November 11, 2012

Mercury Systems Receives $4 Million Order for High-Performance Digital Signal Processing Modules for Synthetic Aperture Radar Application

January 13, 2016

Curtiss-Wright Controls Announces CoolWall(tm) Enclosure Thermal Management Technology Breakthrough

December 17, 2010

Advanced Interconnections Corp. is an ISO 9001:2000 certified designer and manufacturer of electronic interconnect solutions. For more information, contact customer service at 5 Energy Way, West Warwick, RI 02893 USA. Tel.: (800) 424-9850 or (401) 823-5200. E-mail: [email protected]. Data sheets, application notes, and a test report are available online at www.advanced.com/peel.

###

—–

Ann Cibelli

Director of Communications

Advanced Interconnections Corp.

5 Energy Way, West Warwick, RI 02893 USA

Tel: 401.823.5200 or 800.424.9850 ext. 164

Fax: 401.823.8723

Web: www.advanced.com

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
SynaptiCAD offers a Free High Performance Verilog 2001 simulator
Curtiss-Wright Controls Embedded Computing Names Steve Edwards New Chief Technology Officer (CTO)
Related posts
  • Related posts
  • More from author
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Load more
Read also
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Articles

Leveraging AI in standards

June 3, 20250
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

May 28, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.