Note: This update is based on the results of the May 2023 VITA Standards Organization (VSO) meeting, held in Atlanta and hosted by GTRI. Contact VITA if you are interested in participating in any of these working groups. The full reports can be accessed at www.vita.com/StandardsUpdates. Visit the VITA website (http://www.vita.com) for details on upcoming VITA meetings.
ANSI accreditation
Accredited as an American National Standards Institute (ANSI) developer, VITA provides its members with the ability to develop and promote open technology standards.
The following standards have recently been ANSI- and VITA-approved via public VITA consensus ballot:
- ANSI/VITA 48.4-2022, Mechanical Standard for VPX REDI Liquid Flow Through Cooling (revision)
- ANSI/VITA 48.8-2022, Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.0” to 1.5” Pitches (revision)
- ANSI/VITA 62.1-2023, Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module Standard (new standard)
- ANSI/VITA 66.5-2022, Optical Interconnect on VPX – Hybrid Variants (new standard)
- ANSI/VITA 67.3-2022, Coaxial Interconnect on VPX – Spring-Loaded Contact on Backplane (revision)
All published standards are available for download by VITA members and are posted at the online VITA Store for purchase by nonmembers.
VSO study and working group activities
Standards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, while a working group requires sponsorship of at least three VITA members. Several working groups have current projects underway. Here’s a roundup of these projects:
Draft/VITA 46.0-2019 Revision: VPX Baseline
Abstract: This standard describes VITA 46.0 VPX Baseline Standard: an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. This revision supports compliance requirements of higher-level open system standards, adds guide socket/pin rotations for additional power-supply configurations, and provides further clarifications to power wafer current ratings.
Status: The working group made updates for compliance requirements and support for 12 V power. The revised draft is in public ballot.
Draft/VITA 46.31: Higher Data Rate VPX – Solder Tail in Blind Via
Abstract: This document defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud, for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher-data-rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.
Status: VITA 46.31 is approved for VITA Standard Draft Trial Use available to VITA members and is available at the VITA online store. The plan is to complete the ANSI process and release once further connector qualification testing is completed.
ANSI/VITA 48.x: VPX REDI: Cooling
Abstract: The VITA 48 standards provide an overview of the associated plug-in units for air cooling, conduction cooling, and liquid-flow-thru (LFT) and spray-cooling applications.
Status: Several of the standards in this series are being updated to allow for a 100-mm-deep, 1.2-inch-pitch VPX module, or other updates. The working group has completed the public consensus ballot and has submitted document for final ANSI/VITA approval.
VITA 51.4: Reliability Component Derating
Abstract: The goal of this working group is to develop a new component derating standard.
Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. The working group is preparing for public consensus ballot. The working group is developing a draft document that is in review.
VITA 65.x: OpenVPX System Standard
Abstract: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses plug-in module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of slot, backplane, module, and standard development chassis profiles. This revision adds additional profiles, additional communication protocols, higher-speed copper connectors, and a new naming methodology for module profiles.
Status: The working group is adding additional profiles to this standard.
ANSI/VITA 67.3-2020: VPX: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane
Abstract: The VITA 67.3 standard defines an open standard for configuration and interconnect (within the structure of VITA 67.0) enabling an interface compatible with VITA 46 containing multiposition blind-mate analog connectors with coaxial contacts, having fixed contacts on the plug-in module and spring action on the backplane.
Status: The standard is open for revision.
VITA 68.3: Reference SI Model Standard for Gen 4 and Higher Speeds
Abstract: This standard documents a reference model approach for OpenVPX Signal Integrity compliance at baud rates above 10.3125 Gbaud. It defines reference OpenVPX Plug-In Module and backplane s-parameter models that can be used to create end-end OpenVPX reference channels in conjunction with reference VPX connector and device s-parameter models. Signal Integrity compliance for an OpenVPX Plug-In Module or backplane is based on simulation of end-end channel compliance against the requirements of the applicable protocol standard.
Status: The working group is addressing signal integrity compliance for Gen4 and higher speeds for VPX.
Draft/VITA 78.0-2022 Revision: SpaceVPX System
Abstract: This document describes an open standard for creating high-performance fault-tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards.
Status: The working group is evaluating options to support for SpaceFibre, updates for PCIe and system management, and aligning with requirements from the Space Power Consortium.
Draft/VITA 86-2019 Revision: High Voltage Input Sealed Connector Power Supply
Abstract: This standard defines an environmentally sealed connector pair which is compatible with the backplane footprint as defined in VITA 62.0 for 3U power supplies operating in harsh environments operating off of a high-voltage input.
Status: The working group was launched in March and is developing a draft document.
Draft/VITA 87: MT Circular Connectors – Type 1
Abstract: The VITA 87 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT.
Status: The working group is reviewing a draft document.
Draft/VITA 89: MT Circular Connectors – Type 2
Abstract: The VITA 89 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 48 fibers per MT and for physical contact or lensed MT.
Status: The working group is reviewing a draft document.
Draft/VITA 90.x: VNX+
Abstract: Standards for an enhanced small-form-factor system that meets the growing needs of improved size, weight, and power (SWaP) with a rugged, low-cost, fast serial fabric interconnect-based plug-in module. The VITA 90.x family of standards builds on the foundation established by VITA 74 VNX. VNX+ significantly increases performance and system versatility beyond VITA 74, while following its mechanical framework.
Status: New working group formed to make revisions to VNX under VNX+.
Draft/VITA 91: Connector for Higher Density VITA 46 Applications
Abstract: This standard defines a connector system that provides higher pin density to the backplane for VITA 46 3U and 6U VPX applications.
Status: VITA working group to develop a new standard for higher pin density for VPX. Working group is reviewing draft.
Draft/VITA 92: High Performance Cable – Ruggedized 10 Gbaud Bulkhead High Speed, D- Sub, Rectangular Connector for Copper Cables
Abstract: This standard defines a rugged standardized 10 Gbaud interconnect system with a high pin count and high-density, lightweight, rectangular connector (meets MIL-DTL-24308 physical envelope) for I/O. It can support multiple high-bandwidth protocols and power while optimizing SWaP benefits in smaller systems with limited panel space availability.
Status: VITA working group to develop a new standard and is developing a draft.
Draft/VITA 93: Small Form Factor Mezzanine
Abstract: This standard defines a Small Form Factor mezzanine (SFFm) that is significantly smaller than XMC with host and I/O interface connectors. The host interface supports modern high-speed serial fabrics. The I/O interface supports either front-panel or backplane I/O. Multiple SFFm modules can be installed on various carrier-card form factors including 3U/6U Eurocards (VPX, cPCI, VME, etc.), VNX+, PCIe expansion cards, and others. It is suitable for deployment in commercial, industrial, space, or military-grade rugged environments with air-cooled or conduction-cooled formats.
Status: VITA working group to develop a new standard for a small-form-factor mezzanine. Working group is developing a draft.
For a complete list of VITA standards available for purchase and their status, go to www.vita.com/Standards.