VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  People  Boeing Selects Engineering Professors for 2009 Fellowship Program
People

Boeing Selects Engineering Professors for 2009 Fellowship Program

The Boeing CompanyThe Boeing Company—April 23, 20090
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

The Boeing Company [NYSE: BA] today announced the nine engineering professors who will spend eight weeks this summer learning about key research and technology programs and sharing their perspectives as part of the company’s Welliver Faculty Fellowship Program.

“As one of the largest global aerospace companies, Boeing places a high value on the engineering and technical skills required to grow and sustain our business,” said Dale Ramezani, the company’s director of university relations. “We offer this program because these professors are educating our future workforce, helping students develop the skills they need to be successful in engineering, business, and manufacturing and technology careers.”

The participants in the 2009 program, which begins June 15, are:

Professor Specialty University

– George Comber Manufacturing & Mechanical Engineering Technology Weber State University, Ogden, Utah

– M. Javed Khan Aerospace Science Engineering Tuskegee University, Tuskegee, Ala.

More stories

GSA Announces Addition of Intersil CEO David Bell to its Board

November 21, 2011

TEK Microsystems, Inc. Announces Appointment of William Scott as Director of Engineering

February 28, 2006

Reozom Now Offers For Sale by Owner Listings throughout Florida

June 18, 2018

OpenSystems Media Hires Ann Jesse

February 1, 2012

– Daniel Kirk Mechanical and Aerospace Engineering Florida Institute of Technology, Melbourne, Fla.

– Blaine Lilly Mechanical Systems Engineering The Ohio State University, Columbus, Ohio

– Deidre Paris Michael Electrical Engineering Tuskegee University, Tuskegee, Ala.

– Sridhar Santhanam Mechanical Engineering Villanova University, Villanova, Pa.

– Howard Smith Aerospace and Mechanical Engineering Cranfield University, Cranfield, Bedfordshire, UK

– Tein-Min Tan Mechanical Engineering and Mechanics Drexel University, Philadelphia, Pa.

– Kenneth Van Treuren Mechanical Engineering Baylor University, Waco, Texas

The professors will shadow Boeing personnel to get a closer look at the company’s technical and business programs. The professors are also expected to share their expertise by suggesting how Boeing could improve the areas they observe. They will have access to Boeing senior executives and the opportunity to build contacts within the company. During the last week of the program, they will present their findings to Boeing executives and other leaders during meetings at the company’s Leadership Center in St. Louis.

Approximately 150 university professors have participated in this program since it was established in 1995. Interest has come from schools in China, the Congo, France, the United Kingdom, India, Australia and Poland, as well as the U.S.

The program is named for the late A.D. “Bert” Welliver, who was a Boeing senior vice president of engineering and technology. Welliver was recognized throughout the aerospace industry for his vision and leadership in promoting a close working relationship between industry and academia.

About Boeing: Boeing is the world’s leading aerospace company and the largest manufacturer of commercial jetliners and military aircraft combined. Headquartered in Chicago, Boeing employs more than 160,000 people across the United States and in 70 countries. This represents one of the most diverse, talented and innovative workforces anywhere. More than 83,000 of our people hold college degrees — including nearly 29,000 advanced degrees — in virtually every business and technical field from approximately 2,800 colleges and universities worldwide.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Fiber Optic Digital Video Transceiver Module from GAO
NextComputing Adds Third-Generation Quad-Core AMD Opteron(tm) HE Processor to Portable Computer Line
Related posts
  • Related posts
  • More from author
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Load more
Read also
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Eletter Products

SPONSORED: VITA 67.3 Offerings from Teledyne Storm Microwave

February 3, 20260
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

February 1, 20260
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.