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  Eletter Products  SPONSORED: VITA 48.8 Air Flow-Through (AFT) Cooling Development Platform
Eletter Products

SPONSORED: VITA 48.8 Air Flow-Through (AFT) Cooling Development Platform

Elma ElectronicElma Electronic—June 5, 20240
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Cooling of high-performance plug-in cards is one of the biggest challenges in embedded computing designs. The VITA 48.8 Air Flow-Through (AFT) standard allows for a wider pitch between cards with concentrated and targeted cooling over each card where needed, using small fans under the hottest spots on the boards.

Elma’s all-new CompacFrame platform accelerates development and test of 3U plug-in-cards (PICs) designed for use in systems using the AFT cooling method. The CompacFrame includes a backplane with 5 slots on a 1.5” pitch to accommodate the baffled cooling. It also accepts power & ground only backplanes for cards that don’t meet standard profiles.

Functional Features:

  • Accommodates 3U modules according to the VITA 48.8 Air-Flow-Through (AFT) standard
  • Slots are for 1.5” VITA 48.8 -3UB (bottom to top airflow) modules
  • 3U VPX backplane offers 5 slots on a 1.5” pitch aligned to SOSA and OpenVPX
    • Slot 1 of 5-slot AFT backplane is an I/O-intensive payload slot that supports 3U RTM & Expansion Plane access for cabling connections
  • Includes VITA 46.11 chassis manager with rear accessible Ethernet and serial ports
  • 1400W ATX PSU standard
  • Front panel voltage monitoring LEDs and test points
  • Front panel zeroize, NVMRO, reset, and power switches
  • Battery for VBAT connection
  • 5º upwards tilt to card cage for easier viewing & access
  • Integrated carry handle
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SPONSORED: SAVE Compliant Chassis Solutions
SPONSORED: KR to Copper Media Conversion Supporting SOSA™ Aligned Systems
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