Reducing Thermal Risk is a Key Factor for any Programs Success

With the ever increasing board density and power consumption of today’s systems, assumptions pertaining to adequate airflow over each board to prevent sudden and premature failure can no longer be made.

The initial engineering investment related to conducting a comprehensive THERMAL ANALYSIS is far less when compared to the direct and opportunity costs lost after releasing a design which contains serious thermal issues.

For more than 10 years, Hybricon has continually invested in providing strong thermal analysis capabilities. These capabilities utilize two industry leading thermal management software tools: Macroflow™ and Flomerics FLOTHERM™

While the mechanical design is still in the conceptual phase, initial thermal considerations are addressed by using Macroflow™ software. This tool allows for accurate modeling of flow paths through components such as screens, air or liquid filters, power supplies, card arrays, fans or pumps, ducts or tubes, bends, heat sinks or cold plates, and heat exchangers. MacroFlow™ based analysis is very simple and fast in terms of model definition, computation, and examination of results.

As the mechanical design evolves, Hybricon takes advantage of Flomerics FLOTHERM’s™ comprehensive 3D modeling capabilities. This powerful tool enables our engineers to create virtual 3D models of electronic equipment, perform thermal analysis, and test design modifications quickly and easily in the early stages well before any physical prototypes are built. FLOTHERM™ uses advanced CFD (computational fluid dynamics) techniques to predict airflow, temperature and heat transfer in components, boards and complete systems.

During your next electro-mechanical enclosure design, ask yourself if the program can afford to take a system release delay due to thermal management issues. If not, please contact Hybricon at 1-877-Hybricon and be assured your next design will meet the necessary thermal requirements.