Staying cool is not easy in many of today’s densely packaged embedded computing systems. To really get the heat out can sometimes call for some liquid refreshment. Elma Electronic Inc. has a new rugged 1 ATR tall, short enclosure with independent dual liquid-cooled side walls that offers significantly better cooling than conduction-only and airflow designs. Ideal for highly dense embedded systems with exceptional heat dissipation requirements, the new platform holds 6U VPX conduction-cooled boards.
The chassis is available with a 6U OpenVPX backplane on a 1″ pitch with seven slots, each cooled up to 100 W: one slot for storage, one for switch, and five payload slots.
The all-aluminum chassis has electron beam welded fluid channels in the side walls that can use a variety of cooling fluids, including dielectric fluids (PAO), inhibited glycol/water solutions (PGW, EGW), kerosene, deionized water, and salt water.
