|
|
| NEW 3U VPX Vita 46/48 air cooled or conduction cooled Flexible 3U VPX Extender for card development and connection to a LeCroy PCI Express Analyzer with an optional interposer card |
Dec. 23, 2009–PCI-SYSTEMS Inc., a leading supplier of conduction cooled systems, today announced a NEW 3U VPX Vita 46/48 air cooled or conduction cooled Flexible 3U VPX Extender for card development and connection to a LeCroy PCI Express Analyzer with an optional interposer card.
The flexible 3U VPX Extender is an extension between a card cage and the exterior, where you can connect a VPX card for testing, test backplane signals, perform read and write operations.
This product has throughput of 2.5Gbps to 3.5Gbps.
Conforms to VPX specifications 100 Ohm Differential pair routing P0 Signals are single ended signals connected point- to- point P1 Signals are mainly differential pairs
P2 Signals are Input output Signals
The 3U VPX extender fits into air cooled and conduction cooled chassis Optional Mezzanines: Re-driver mezzanine for add-on cards
Re-driver mezzanine for CPU cards
Interposer mezzanine card (LeCroy)
Custom mezzanines The LeCroy Interposer Mezzanine card allows users to connect a LeCroy PCI Express Analyzer to the extender board.
The analyzer can be used to capture, decode and display all traffic on the PCI Express bus for troubleshooting, debugging and monitoring system performance. The Interposer Card supports PCI Express lane widths up to x8 at data rates of 2.5 GB/s.
The card supports an analyzer connection to LeCroy PETracer(tm) ML or Summit(tm)T2-16 Analyzers.
PCI-SYSTEMS Inc. manufactures a variety of conduction cooled carrier boards for different bus architectures and can customize mechanical shapes and layout changes even for small quantities with fast turnaround times.
PCI-SYSTEMS Inc. develops and manufactures intelligent CPU and peripheral boards as well as advanced mechanical design solutions in the US and Germany for many platforms that provide precision control of robotic and automated equipment in the semiconductor, medical and industrial equipment markets as well as for ruggedized embedded OEM applications in airborne and defense applications.