VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Groundbreaking 3U OpenVPX Processing Solution Unveiled by Mercury Systems
New Products

Groundbreaking 3U OpenVPX Processing Solution Unveiled by Mercury Systems

Mercury SystemsMercury Systems—March 13, 20150
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail


OpenVPX Ensemble LDS3506 processing module

OpenVPX Ensemble LDS3506 processing module

CHELMSFORD, Mass. – Mercury Systems, Inc. (NASDAQ: MRCY), a leading high-tech commercial provider of more affordable secure and sensor processing subsystems powering today’s critical defense and intelligence applications, announced the rugged OpenVPX™ Ensemble® LDS3506 processing module that seamlessly integrates the Intel® Xeon® processor D system-on-a-chip (SoC) product family (formerly codenamed “Broadwell DE”) with Xilinx’s powerful Ultrascale™ FPGA in a SWaP-constrained 3U package. This dense union of best available commercial-item general processing and FPGA resources produces a highly versatile, affordable and interoperable building block for embedded, high-performance computing applications with additional low-latency, refresh and mission capabilities.

The Ensemble LDS3506 leverages Mercury’s fourth generation of highly SWaP-efficient packaging technology to securely deliver the Intel Xeon processor D product family for reliable deployment in scalable subsystems right to the tactical edge. The Ensemble LDS3506 secures and cools the best commercial technology to produce a dense, powerful combination of general server-class and low-latency front-end FPGA processing in an open systems architecture module that is designed and made in the USA.

More stories

Advantech Enters 6U VPX Market for rugged modular computing

June 17, 2013

SIE Computing Solutions Introduces Application-Ready Video Processing Solution for Rugged Situational Awareness

June 6, 2011

Credo First to Demonstrate 28G SerDes on 16FinFET Plus Technology

May 6, 2015

MicroMax announces its M-Max V75 Series Highly Rugged PC/104 Chassis

June 3, 2016

“With over 256 peak GFLOPS of general processing power from the Intel processor alone, the Ensemble LDS3506 represents a disruptive force in the 3U embedded market space,” said Ian Dunn, Vice President of Mercury Systems’ Embedded Products group. “But, it is the unique combination of this latest Intel technology combined with the low-latency and versatile FPGA resources that delivers a potent compute solution for multidimensional SWaP-constrained applications, particularly those that are sensitive to performance and latency, such as electronic warfare (EW), electro-optical/infrared (EO/IR), image intelligence (IMINT) and other mission or sensor processing applications.”

The LDS3506 provides x4 Gen3 PCIe connectivity across the data plane via Xilinx’s FPGA device, with multiple DMA-enabled non-transparent bridge (NTB) interfaces, giving users the versatility needed to construct powerful processing subsystems quickly. The module’s latest Xilinx FPGA hosts Mercury’s Protocol Offload Engine Technology (POET™) to give each module the ability to refresh its mission capability, provide information assurance abilities, or even refresh or upgrade its switch fabric itself without affecting any hardware.

“The Intel Xeon processor D family featuring Intel Advanced Vector Extension 2.0 (Intel AVX2) support, SoC architecture and the integrated Platform Controller Hub enables server-class performance within smaller form factors, including 3U OpenVPX,” said Steve Price, General Manager, Communications Infrastructure Division, Intel. “The elegance of the SoC architecture of the Intel Xeon processor D-1540 supports a new range of dense, efficient system designs in both the micro-server market and the embedded defense application space.”

The Ensemble LDS3506 supports open data movement middleware, including Open MPI and OpenMPI/OFED™, VITA 46.11 system management, and standard optimized math libraries. Modules will be initially populated with the 45W TDP Xeon® D-1540 processor and will be available with additional Intel® Xeon® D series processors as they become available. Customer demonstrations will begin spring 2015 and production units will become available later this year for air-cooled, conduction-cooled, and Air Flow-By™ systems. Additional products in the 6U OpenVPX form factor based on the Intel Xeon processor D family are expected to be announced by Mercury later this year.

For detailed specifications and general product information, visit www.mrcy.com/LDS3506 or contact Mercury at (866) 627-6951 or [email protected].

Mercury Systems – Innovation That Matters™

Mercury Systems (NASDAQ:MRCY) is the better alternative for affordable, secure and sensor processing subsystems designed and made in the USA. Optimized for program and mission success, Mercury’s solutions power a wide variety of critical defense and intelligence applications on more than 300 programs such as Aegis, Patriot, SEWIP, F-35 and Gorgon Stare. Headquartered in Chelmsford, Massachusetts, Mercury Systems is a high-tech commercial company purpose-built to meet rapidly evolving next-generation defense electronics challenges. To learn more, visit www.mrcy.com.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
DoD budget request and COTS suppliers
Mercury Systems Receives $2 Million in Orders from US Navy for DRFM Jammers
Related posts
  • Related posts
  • More from author
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Load more
Read also
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Articles

Leveraging AI in standards

June 3, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.