VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Advanced Thermal Solutions Raises the Bar in Heat Sink Thermal, Vibration and Shock Performance
New Products

Advanced Thermal Solutions Raises the Bar in Heat Sink Thermal, Vibration and Shock Performance

Advanced Thermal Solutions, IncAdvanced Thermal Solutions, Inc—May 26, 20150
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail


clipKIT Heat Sink Attachment System from Advanced Thermal Solutions, available from Digi-Key

clipKIT Heat Sink Attachment System from Advanced Thermal Solutions, available from Digi-Key

clipKIT is a line of patented, reliable heat sink attachment assemblies featuring the widely used maxiGRIP™ and superGRIP™ frame clip and spring clip. They are available for 15 – 45mm component packages and are designed for heat sinks with a base thickness of 1.75 to 4mm.

More stories

New Dual A/D Converter FMC from VadaTech Features 12-bit @ 4.0 GSPS

March 25, 2015

Lynx Software Technologies Announces Security Critical RTOS Support for Curtiss-Wright’s VPX6-187 Platform

November 16, 2014

New CFast-based Storage XMC from Elma Features High Speed Operation; Front Removability

September 14, 2011

Wind River Simics Adds Support for Freescale QorIQ P5020, P5010 and P3041 in Advance of Silicon Availability

June 22, 2010

Instead of relying on thermal tape or epoxy, which can damage the board or component during rework, the reliable clip attachment system provides a secure hold without the risk of damaging the PCB, saving time and cost. The ultra-thin plastic frame clip and stainless steel spring clip are corrosion-resistant, flame retardant and pass Telecordia shock and vibration standards, ensuring the heat sink will reliably stay in place.

clipKIT attachments eliminate the need to drill holes in a PCB, saving valuable real estate on the PC for high density routing. The thin frame clip occupies minimal space around a component’s perimeter, compared to push pin attachments or stand-off hardware which leaves little space on already overcrowded PCBs. The two-part attachment system provides a uniform force which enhances heat transfer and improves TIM performance by up to 20%.

“Thermal management is critical for today’s systems,” said Dr. Kaveh Azar, CEO of Advanced Thermal Solutions. “We developed clipKIT to facilitate the attachment of custom and off the shelf heat sinks. We’re launching them exclusively with Digi-Key because they are uniquely close to the engineering community and their challenges.”

“We are pleased to be the exclusive distributor of the ATS clipKIT assemblies,” said Tom Busher, VP, Global IP&E at Digi-Key. “We believe this new product line will meet and exceed our customers’ thermal management needs and we’re looking forward to offering more customized solutions from ATS in the future.”

The full clipKIT line can be conveniently ordered with no minimum from Digi-Key, the exclusive global distributor of clipKIT and many other ATS thermal management products.

More information on clipKIT is available on the ATS website, www.qats.com, by emailing [email protected] or calling 781-769-2800.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
DX4-BADGER • 6G mSATA RAID XMC Module
Tiny footprint makes big impact
Related posts
  • Related posts
  • More from author
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Load more
Read also
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.