When it comes to High-Performance Embedded Computing (HPEC), thermal management and heat dissipation are key factors for enabling the system to provide its full performance when running at the highest temperature. Creative Electronic Systems’ (CES) CIO5-2040 is a Size, Weight, and Power (SWaP)-optimized dual processor SBC combining 1.5 teraflops and 210K DMIPS of processing power.
Aimed at serving applications such as radars, Communications Intelligence (COMINT), Signals Intelligence (SIGINT), or Electronic Intelligence (ELINT), the CIO5-2040 is built using a mirrored architecture implementing two 5th Generation Intel Core i7 processors. The processors are fed with data through four 10 Gb Ethernet links and three PCI Express Gen3 x8 links routed in the backplane.
CES has designed a composite frame for the CIO5-2040, providing the thermal dissipation of copper while weighing as light as aluminum. As a result, the full performance of the board is available even at +85 °C, and the board together with the frame weigh 30 percent less than its copper-framed counterparts.