Memory solutions optimized for density while withstanding the harshest operating environments are a rare breed. Mercury Systems, Inc. Advanced Microelectronics Center (AMC) announced the latest development in its high density secure memory product line, integrating double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) with its size, weight, and power (SWaP)-efficient packaging technology. Replacing up to 18 industrial or commercial DDR4 devices with a single military-hardened component, Mercury delivers space savings, up to 75 percent, in a ball grid array (BGA) package with data transfer speeds up to 3200 Mb/s. Defense prime contractors now have a trusted supplier of compact, military-grade DDR4 memory for high-speed, low-power, mission-critical subsystems.
The three-dimensional packaging technology developed transforms a two-dimensional array of discrete memory devices into a single, vertically stacked, dense BGA package without sacrificing the benefits of DDR4 adoption. Component selection and integration is optimized through advanced thermal, mechanical, and electrical modeling. Mercury’s precision engineering delivers the robust mechanical integrity needed to withstand the harshest of operating environments. For enhanced board-level reliability over commercial memory devices, lead alloy solder is used for the mechanical and electrical interface to the customer’s mission computing subsystems.
All high-density secure memory products are manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA) trusted facility.
