Cooling of high-performance plug-in cards is one of the biggest challenges in embedded computing designs. The VITA 48.8 Air Flow-Through (AFT) standard allows for a wider pitch between cards with concentrated and targeted cooling over each card where needed, using small fans under the hottest spots on the boards.
Elma’s all-new CompacFrame platform accelerates development and test of 3U plug-in-cards (PICs) designed for use in systems using the AFT cooling method. The CompacFrame includes a backplane with 5 slots on a 1.5” pitch to accommodate the baffled cooling. It also accepts power & ground only backplanes for cards that don’t meet standard profiles.
Functional Features:
- Accommodates 3U modules according to the VITA 48.8 Air-Flow-Through (AFT) standard
- Slots are for 1.5” VITA 48.8 -3UB (bottom to top airflow) modules
- 3U VPX backplane offers 5 slots on a 1.5” pitch aligned to SOSA and OpenVPX
- Slot 1 of 5-slot AFT backplane is an I/O-intensive payload slot that supports 3U RTM & Expansion Plane access for cabling connections
- Includes VITA 46.11 chassis manager with rear accessible Ethernet and serial ports
- 1400W ATX PSU standard
- Front panel voltage monitoring LEDs and test points
- Front panel zeroize, NVMRO, reset, and power switches
- Battery for VBAT connection
- 5º upwards tilt to card cage for easier viewing & access
- Integrated carry handle
