As modern embedded computing systems push for higher density and greater modularity, VITA 67.3 Nano and SMPM RF assemblies have become essential components in VPX architectures. This latest VITA specification introduces increased flexibility in how RF connectors can be integrated, enabling designers to customize solutions without sacrificing performance or interoperability. Its fixed plug in module contacts are engineered to mate seamlessly with spring loaded backplane contacts, creating a reliable, rugged interface ideal for high demand environments.
VITA standards are built around cross vendor compatibility and high-frequency performance supporting operation up to 40 GHz and beyond. This ensures system designers can deploy advanced RF capabilities while maintaining confidence in connector alignment, durability, and long-term electrical stability.
Teledyne Storm Microwave elevates these assemblies further through the integration of our Storm Flex® cables. By pairing flexible, durable Storm Flex® technology with VITA-compliant RF contacts, we deliver assemblies that stand up to harsh conditions while simplifying cable routing and reducing layout time. Storm Flex® also offers an effective alternative to traditional semi rigid cable sizes including 0.034″, 0.047″, and 0.086″ making it ideal for tight packaging and complex system designs.
Technical Specifications
- Operating Frequency — DC to 40 GHz
- VSWR (max) — 1.45:1 (DC to 40 GHz)
- Channel Isolation — >100 dB (3–26.5 GHz)
- Mating Cycles — 500+ cycles
- Environmental — Tested for MIL-STD-202 (Shock, Vibration, Thermal)
Teledyne Storm Microwave VITA 67.3 solutions help defense, aerospace, and embedded computing teams build with confidence.
- Electronic Warfare & SIGINT: High-bandwidth signal processing in rugged environments.
- Radar: Reliable high-frequency transmission for phased array antennas.
- Aerospace & Avionics: Space-saving, high-density interconnects (ATRs).
- SOSA Aligned: Full compatibility with Sensor Open Systems Architecture (SOSA).
Ready to optimize your embedded system? TSM’s VITA 67.3 provides a balanced solution of density, durability, and high-frequency performance for embedded systems, combining resilience with efficiency.
