SAN JOSE, CA – FEB. 3, 2009 – Giving network and telecommunications design engineers an advanced modular connection system that deliv...
Category: Industry News
Landenberg, PA – February 3, 2009 – W. L. Gore & Associates, Inc. (Gore) has introduced a very low-profile SFP+ direct attach copper ...
SAN JOSE, Calif., February 2, 2009 – As today’s economic climate increases the pressure on electronics makers to ‘do more with ...
SAN JOSE, Calif., February 2, 2009 – Xilinx, Inc. (NASDAQ: XLNX) today introduced a new generation of its flagship Virtex® high-perfor...
SAN JOSE, Calif., February 2, 2009 – Xilinx (NASDAQ:XLNX) today introduced the next generation in the company’s flagship high-perform...
Altera introduces Stratix® IV GT FPGAs, the only FPGA with integrated 11.3-Gbps transceivers, and Arria® II GX FPGAs, the lowest power,...
Hot Swap PMC Carrier For AMC Modul TAMC260 TEWS TECHNOLOGIES today announced the TAMC260, a double-width full-size PMC carrier for AMC that suppo...
The 16-channel SerDes modules are designed to plug into VPX backplanes and directly test the channel compliance. They can be used to test VPX swi...
CHARLOTTESVILLE, VA January 28, 2009 GE Fanuc Intelligent Platforms, a unit of GE Enterprise Solutions, today announced the V7875 single board co...
SANTA CLARA, CALIF., January 28, 2009 – Power Architecture® on multicore and virtualization presentations and demonstrations from Powe...