VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Full/Half Duplex Serial Communication cPCI Module
New Products

TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Full/Half Duplex Serial Communication cPCI Module

TEWS TECHNOLOGIES GmbHTEWS TECHNOLOGIES GmbH—July 20, 20100
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail



TEWS TECHNOLOGIES extends its tradition of delivering high-density I/O solutions to CompactPCI with its introduction of the 4 channel TCP467, an extended temperature and high density 3U CompactPCI Serial Communications Controller. The TCP467 is ideal for applications in transportation, communications, process control, and COTS.

The new module provides 4 channels of high performance RS232/RS422/RS485 selectable serial connectivity. The serial channels can be individually programmed to operate as RS232, RS422 or RS485 full/half duplex interfaces. In addition, programmable termination is provided for the RS422/RS485 interfaces. After power-up all serial I/O lines are in a high impedance state for critical applications. Physical connection is achieved through front panel I/O with four RJ45 Modular Jack connectors.

More stories

Interface Concept launhces an Intel Core2 Duo processor SL9380-based VME Single board Computer with high performance Graphic Process Unit

November 28, 2011

4DSP Updates Its IndustryLeading FPGA Mezzanine Card (FMC) Line With the FMC163

March 10, 2015

Acromag’s New Next Generation PCIe-Based AcroPack(tm) I/O Modules

May 11, 2016

Microsemi Expands DDR3 SDRAM Family with 4GByte Solution for High-reliability Applications

November 3, 2011

Each RS232 channel supports RxD, TxD, RTS, CTS and GND. RS422 and RS485 full duplex supports a four wire interface (RX+, RX-, TX+, TX-) plus ground (GND). RS485 half duplex supports a two wire interface (DX+, DX-) plus ground (GND).

All channels generate interrupts on CompactPCI interrupt INTA. For fast interrupt source detection the UART provides a special Global Interrupt Source Register.

Each serial channel of the cPCI module has separate 64 byte receive and transmit FIFOs to significantly reduce the processing overhead required to provide data transactions to the transceivers. The FIFO trigger levels are programmable, and the baud rate is individually selectable up to 921.6 kbps for RS232 channels and 5.5296 Mbps for RS422/RS485 channels. The UART offers readable FIFO levels.

The TCP467 operates in extended temperature range (-40°C to +85°C) standard. All TEWS TECHNOLOGIES products feature a five-year warranty.

Extensive software support for major operating systems such as Windows, Linux, VxWorks, Integrity, and QNX is available.

About TEWS TECHNOLOGIES

TEWS TECHNOLOGIES is a leading solutions provider of embedded I/O and CPU products based on open architecture standards such as PMC, IndustryPack® (IP), CompactPCI, standard PCI, and VME. TEWS has more than 30 years of experience designing and building turn-key embedded interface solutions using the philosophy to listen and respond to our customers’ needs. Using this ‘customer first’ approach, TEWS has developed a large number of standard and custom products for industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS applications. TEWS’ line of embedded I/O solutions is available worldwide through a global network of distributors. For more information, go to www.tews.com.

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
InnoDisk Announces a Breakthrough in the Security Storage Solution.
MEMS Company Micralyne Appoints Former TI Manager Nancy Fares as President and CEO
Related posts
  • Related posts
  • More from author
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Load more
Read also
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Articles

Leveraging AI in standards

June 3, 20250
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

May 28, 20250
Eletter Products

SPONSORED: Mission-Ready Chassis Management Aligned to SOSA®

May 28, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.