VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  New ATS Heat Sinks Feature Push Pin Mounting
New Products

New ATS Heat Sinks Feature Push Pin Mounting

Advanced Thermal Solutions, IncAdvanced Thermal Solutions, Inc—July 19, 20110
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail



Each heat sink comes with a pair of durable plastic or brass push. The pins run through opposite corners of the heat sinks and mount securely into 3.00 mm holes in the PCB laid out in industry standard patterns. Plastic pins are lighter and non-electrically conductive; brass pins have added strength and durability for more rugged applications or thicker devices. An integral spring on each pin provides approximately 2 lbs of retention load, depending on the height of the component and the PCB thickness.

More stories

National Semiconductor’s New WEBENCH Visualizer Enables Real-Time Comparison of Power Solutions Across Multiple Criteria

November 9, 2009

Eurocom adds NVIDIA GeForce GTX 580M & NVIDIA Quadro 5010M MXM 3.0b to its Modular VGA Offerings for Modular Embedded and CUDA Developers

July 20, 2011

Aonix Announces New Graphics Support in PERC(r) Ultra Virtual Machine

September 29, 2009

Signatec Unveils PX14400, Its High-Speed PCI-Express Digitizer Capable of Sustained Recordings Over 1.2 GB/s with Xilinx Virtex-5 FPGAs for Embedded Real-Time Processing

September 15, 2009

The patented ATS maxiFLOW sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling in the restricted airflow conditions typical of today’s condensed electronic packages. The heat sinks are fabricated from light weight, extruded aluminum which minimizes thermal resistance from the base to the fins. They have a protective green anodized surface.

Tests on maxiFLOW heat sinks with an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using conventional straight-fin heat sinks.

The push pin mount maxiFLOW heat sinks are available in sizes ranging from 37.4 x 37.5 x 10.0 mm (L x W x H) up to 41.4 x 45.75 x 24.5 mm (L x W x H). Each maxiFLOW heat sink is provided preassembled with a Chomerics T766 phase change thermal interface material (TIM) for improved component-to-sink thermal transfer. The pad is centered on the base of the sink.

Prices for ATS push pin mounted heat sinks start at $3.56 in high volume. More information on push pin heat sinks is found on Qats.com or by calling 781-769-2800.

About Advanced Thermal Solutions

Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. Qats.com

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Falcon Electric Enhances Uninterruptible Power Supply (UPS) Communications with Addition of Advanced SNMP/HTTP Agent
Curtiss-Wright Controls Electronic Systems Introduces New Family of Network Attached Storage File Servers
Related posts
  • Related posts
  • More from author
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Load more
Read also
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Eletter Products

SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O

August 9, 20230
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

August 9, 20230
Eletter Products

SPONSORED: Chassis Management Family Ensures Efficient Operation in Systems Aligned to SOSA

August 8, 20230
Load more

Recent Posts

  • DÉJÀ VU – THE UBIQUITY OF VITA 57
  • Attn. VITA members: Registration open for September 2023 VSO Face to Face
  • TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications
  • SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O
  • SPONSORED: SpaceVPX Solutions From Pixus Technologies

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.