VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes
New Products

Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes

Elma Bustronic Corp.Elma Bustronic Corp.—September 14, 20090
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

XPand6215 Redefines What is Possible in an Embedded, SWaP-Optimized System

November 14, 2018

Curtiss-Wright now shipping industry’s first 6U FPGA card with trio of Xilinx Virtex-7 FPGAs

April 30, 2014

VersaLogic shipping new Arm-based board with wireless I/O

April 17, 2019

XM RS1/20x – High Performance XMC Serial Communications Adaptor

August 21, 2012


VME64X Backplane

VME64X Backplane

Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has 6U and 7U VME64x backplanes in over 30 slot sizes and hundreds of standard configurations.

Bustronic offers all of the common slot sizes for its 6U and 7U backplanes, which range from 2-21 slots. With various power, connection pin tail size, shroud, P0 connector, and other options there are hundreds of standard configurations available. The 7U backplanes have an extra 1U of height for extra power bugs to accommodate higher power requirements. In some configurations, this taller backplane acts as an air baffle to redirect the airflow path to aid cooling. In other chassis designs, the 6U height is required due to space restraints or airflow considerations.

The Bustronic VME64x backplanes come with power bugs for +5V, +3.3V, +/-12V, +/-V1, +/- V2, and GND. Compliant to ANSI/VITA 1.1-1997 VME extension standard and ANSI/VITA 1-1994, the VME64x line features a controlled-impedance stripline design. The backplanes have an active BUSGRANT, IACK daisy chain and optional stiffeners. The standard design features three 2 oz. copper ground planes, which fully shield the backplane, minimize EMI/RFI emissions susceptibility, minimize crosstalk, and maximize power distribution. In addition, the robust outer ground layers provide mechanical and EMI/RFI protection for the backplane.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Power Architecture(r) Technology to be Focal Point of Inaugural Linley Tech Processor Conference
Hybrid architecture board melds this and that
Related posts
  • Related posts
  • More from author
Articles

VITA Hall of Fame

December 1, 20250
Articles

Designing with QMC

December 1, 20250
Articles

VITA standards activity updates

December 1, 20250
Load more
Read also
Articles

VITA Hall of Fame

December 1, 20250
Articles

Designing with QMC

December 1, 20250
Articles

VITA standards activity updates

December 1, 20250
Articles

Leveraging AI in standards

December 1, 20250
SOSA Aligned Chassis Management from Development to Deployment
Eletter Products

SPONSORED: VPX Chassis Management – US Made, Open Source In-field Code Upgrades

November 25, 20250
Eletter Products

SPONSORED: Advanced SBC powered by NVIDIA® Jetson AGX Orin™ Industrial

November 24, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.