VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes
New Products

Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes

Elma Bustronic Corp.Elma Bustronic Corp.—September 14, 20090
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

Curtiss-Wright Launches Groundbreaking Fabric40(tm) Next-Generation Fabric Program to Increase Bandwidth of Embedded Military Systems

July 17, 2013

Pentek Expands Talon Extreme Rugged 1/2 ATR Recorder Family

November 27, 2018

Pentek Now Shipping RFSoC FPGA Software Radio Solutions for Defense and Wireless Applications

October 2, 2018

Pentek Introduces New Portable, Rugged Sentinel Intelligent Signal Scanning Recorder

October 25, 2016


VME64X Backplane

VME64X Backplane

Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has 6U and 7U VME64x backplanes in over 30 slot sizes and hundreds of standard configurations.

Bustronic offers all of the common slot sizes for its 6U and 7U backplanes, which range from 2-21 slots. With various power, connection pin tail size, shroud, P0 connector, and other options there are hundreds of standard configurations available. The 7U backplanes have an extra 1U of height for extra power bugs to accommodate higher power requirements. In some configurations, this taller backplane acts as an air baffle to redirect the airflow path to aid cooling. In other chassis designs, the 6U height is required due to space restraints or airflow considerations.

The Bustronic VME64x backplanes come with power bugs for +5V, +3.3V, +/-12V, +/-V1, +/- V2, and GND. Compliant to ANSI/VITA 1.1-1997 VME extension standard and ANSI/VITA 1-1994, the VME64x line features a controlled-impedance stripline design. The backplanes have an active BUSGRANT, IACK daisy chain and optional stiffeners. The standard design features three 2 oz. copper ground planes, which fully shield the backplane, minimize EMI/RFI emissions susceptibility, minimize crosstalk, and maximize power distribution. In addition, the robust outer ground layers provide mechanical and EMI/RFI protection for the backplane.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Power Architecture(r) Technology to be Focal Point of Inaugural Linley Tech Processor Conference
Hybrid architecture board melds this and that
Related posts
  • Related posts
  • More from author
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Eletter Products

SPONSORED: VITA 67.3 Offerings from Teledyne Storm Microwave

February 3, 20260
Load more
Read also
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Eletter Products

SPONSORED: VITA 67.3 Offerings from Teledyne Storm Microwave

February 3, 20260
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

February 1, 20260
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Articles

VITA Hall of Fame

December 1, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.