VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes
New Products

Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes

Elma Bustronic Corp.Elma Bustronic Corp.—September 14, 20090
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

VPG Foil Resistors Announces Ultra-High Precision Military and Space Grade Resistors for High-Performance Current Sensing within Mission-Critical Applications

July 23, 2017

Portwell Announces New Quad-Port and Dual-Port Network Adapters with Cost-Effective Bypass Design

August 13, 2013

New ATR Enclosure Solutions Offered by Pixus Technologies

October 4, 2012

Aitech’s Low-power, Rad-tolerant Boards Provide Real-time Data in Satellite Program

August 10, 2011


VME64X Backplane

VME64X Backplane

Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has 6U and 7U VME64x backplanes in over 30 slot sizes and hundreds of standard configurations.

Bustronic offers all of the common slot sizes for its 6U and 7U backplanes, which range from 2-21 slots. With various power, connection pin tail size, shroud, P0 connector, and other options there are hundreds of standard configurations available. The 7U backplanes have an extra 1U of height for extra power bugs to accommodate higher power requirements. In some configurations, this taller backplane acts as an air baffle to redirect the airflow path to aid cooling. In other chassis designs, the 6U height is required due to space restraints or airflow considerations.

The Bustronic VME64x backplanes come with power bugs for +5V, +3.3V, +/-12V, +/-V1, +/- V2, and GND. Compliant to ANSI/VITA 1.1-1997 VME extension standard and ANSI/VITA 1-1994, the VME64x line features a controlled-impedance stripline design. The backplanes have an active BUSGRANT, IACK daisy chain and optional stiffeners. The standard design features three 2 oz. copper ground planes, which fully shield the backplane, minimize EMI/RFI emissions susceptibility, minimize crosstalk, and maximize power distribution. In addition, the robust outer ground layers provide mechanical and EMI/RFI protection for the backplane.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Power Architecture(r) Technology to be Focal Point of Inaugural Linley Tech Processor Conference
Hybrid architecture board melds this and that
Related posts
  • Related posts
  • More from author
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Load more
Read also
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.