VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes
New Products

Elma Bustronic has Over 30 Standard Slot Sizes for 6U and 7U VME64x Backplanes

Elma Bustronic Corp.Elma Bustronic Corp.—September 14, 20090
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

MIL-STD-1553 Terminal with Integrated Transformers for XMC/PMC Applications

October 27, 2016

Concurrent Technologies announces a range of 3U VPX(tm) I/O boards

February 22, 2018

Curtiss-Wright Enhances its Inter-Processor Communications (IPC) Software with SRIO Gen 2 Support

July 16, 2013

RFEL adds new features to latest version of its award-winning ChannelCore Flex advanced Channeliser IP core

February 22, 2016


VME64X Backplane

VME64X Backplane

Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has 6U and 7U VME64x backplanes in over 30 slot sizes and hundreds of standard configurations.

Bustronic offers all of the common slot sizes for its 6U and 7U backplanes, which range from 2-21 slots. With various power, connection pin tail size, shroud, P0 connector, and other options there are hundreds of standard configurations available. The 7U backplanes have an extra 1U of height for extra power bugs to accommodate higher power requirements. In some configurations, this taller backplane acts as an air baffle to redirect the airflow path to aid cooling. In other chassis designs, the 6U height is required due to space restraints or airflow considerations.

The Bustronic VME64x backplanes come with power bugs for +5V, +3.3V, +/-12V, +/-V1, +/- V2, and GND. Compliant to ANSI/VITA 1.1-1997 VME extension standard and ANSI/VITA 1-1994, the VME64x line features a controlled-impedance stripline design. The backplanes have an active BUSGRANT, IACK daisy chain and optional stiffeners. The standard design features three 2 oz. copper ground planes, which fully shield the backplane, minimize EMI/RFI emissions susceptibility, minimize crosstalk, and maximize power distribution. In addition, the robust outer ground layers provide mechanical and EMI/RFI protection for the backplane.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Power Architecture(r) Technology to be Focal Point of Inaugural Linley Tech Processor Conference
Hybrid architecture board melds this and that
Related posts
  • Related posts
  • More from author

The VITA Technologies 2026 Resource Guide is here!

June 15, 20260

VITA Standards Update

June 15, 20260
Articles

VITA 100 and the next phase of embedded computing standards

June 15, 20260
Load more
Read also

The VITA Technologies 2026 Resource Guide is here!

June 15, 20260

VITA Standards Update

June 15, 20260
Articles

VITA 100 and the next phase of embedded computing standards

June 15, 20260
Articles

VME in defense systems: A legacy of reliability, longevity, and determinism

June 15, 20260
Articles

MOSA, SOSA, and VITA explained: The standards behind VPX defense electronics

June 15, 20260
Eletter Products

SPONSORED: Mission-Ready Chassis Management Aligned to SOSA®

June 4, 20260
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.