Multi-vendor presentations and demonstrations at Global RapidIO Design Summits in China and Japan attract record numbers and spur discussions around current and future designs.
On the heels of its highly successful Global RapidIO® Design Summit in Boston, the RapidIO Trade Association announced the completion of five immensely successful Summits in Japan and China. These Summits focused on Serial RapidIO technology, interoperability, applications and designs, and featured key members of the RapidIO eco-system including ENEA Systems, Freescale Semiconductor, FuturePlus Systems, Integrated Device Technology (IDT), Mercury Computer Systems, PMC-Sierra, Silicon Turnkey Express, Texas Instruments, Tundra Semiconductor and Xilinx. In addition, demand for RapidIO standard and product information reached a peak during the Texas Instruments Developer Conference (TIDC) in Shenzhen, China.
“The interest in RapidIO technology and products for a wide range of OEM designs throughout Asia-Pacific is among the strongest in the world and growing rapidly,” said Tom Cox, executive director of the RapidIO Trade Association. “Not only was the response to our regional events extremely welcomed, but the depth of discussion around current and future designs made it clear that RapidIO is truly a global standard that is being widely adopted as the technology of choice in the embedded market.”
The Global RapidIO Design Summits drew more than 150 attendees who participated in highly interactive discussions on design, deployment and the RapidIO technology roadmap. Presentations, which can be downloaded at www.RapidIO.org/education/designsummit2006/, featured a Technology Introduction; A Comparison Of Serial RapidIO, Ethernet, and PCIe; the Benefits Of RapidIO in the Communication Infrastructure; Serial RapidIO IP and System Solutions; Serial RapidIO and DSP Clusters in an AMC Form Factor; a Node B+Wimax application note, a RapidIO 10G application example; the Distributed Transparent Inter Process Communications for RapidIO, and Planning Ahead for Serial RapidIO Validation.
In addition to the full-day of presentations and interactive discussions, the Summits featured working demonstrations from industry leaders showing the fundamental principals of RapidIO discovery, enumeration and initialization of multi-vendor devices in the same system, demonstrating the robustness of the RapidIO ecosystem.
Hosted by the RapidIO Trade Association, the 2006 Global Design Summits are sponsored by Altera, AMCC, EMC, ENEA, Ericsson, Freescale Semiconductor, Lucent Technologies, Mercury Computer Systems, Micro Memory, MontaVista, PMC-Sierra, Rydal, Texas Instruments, Tundra Semiconductor Corporation, Wind River, and Xilinx. The Global RapidIO Design Summit – India will be held November 29th in Bangalore. Details on this and other events can be found on www.RapidIO.org.
The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems.
The growth of the RapidIO ecosystem in 2005 seeded deployment of RapidIO technology in next generation wireless infrastructure, edge networking and military systems. Over 2006, the deployment of RapidIO will be furthered through RapidIO Trade Association initiatives including interoperability, interworking, the next Generation PHY Release, and system-level application demonstrations. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.