FREMONT, California – April 4, 2006 – Themis Computer announces its new Slice switched computing initiative, designed to meet the escalating demands for thermal and kinetic management, imposed by next generation high density/high performance mission-critical computing. A processor-independent architecture, the Themis “Slice” platform allows users to mix, match, and manage SPARC and x86 architectures, Solaris, Windows, and Linux operating systems, in combination with third party network servers, storage and switches. Quorum, Themis’ real-time, policy based resource manager, insures contracted application Quality of Service (QoS), for heterogeneous computing resources. Designed for high density, high performance computing, the Themis Slice Architecture is ideal for those who are looking for highly available, horizontally scalable processing power and lower life cycle cost of ownership.
Themis Slice is offered in air and liquid cooling variants that provide thermal headroom to accommodate aggressive scaling of commercial microprocessor core density, speed and power. This open and modular design eases the burden of spiral technology refresh, extending computing infrastructure investments for complete lifecycle management.
“Themis Computer has achieved a breakthrough reduction in Space, Weight and Power (SWAP), for mission-critical distributed computing systems,” stated William E. Kehret, President of Themis Computer. “By functionally disaggregating commercial computing resources and housing them in a standardized footprint, purpose-built enclosure, the Themis Slice Architecture enables high compute densities with superior thermal and kinetic management, without external shock and vibration isolation,” Mr. Kehret added.
All Themis Slice elements are inherently rugged, have a uniform mechanical footprint and a standard rack height (1-RU) and depth (22″). Up to five Slice elements, including a common Power Slice can be combined in a 5RU docking station, or Subrack. The Subrack blind mates with connectors on the Slice element, providing power distribution, cable management and dripless couplings for liquid cooling of the constituent Slice Subrack modules. The Subrack allows liquid and air cooled Slices to be intermixed, within a single docking station, providing blind mated dripless couplers to cooling liquid manifolds in the docking station. Subracks can be interconnected, using external switches, to configure highly scalable grid computing systems.
Within the Subrack, Slice elements plug into an InfiniBand high-speed, low latency serial switch fabric, so that clusters of up to five Slice elements can be interconnected, without external switches. Processor Slices interface with General Purpose I/O (GPIO) Slices over a PCI-Express high-speed serial fabric, also supported by the Subrack. Other Cluster elements include Storage Slices and a four port Gig-E Target Channel Adapter co-located in the Power Slice.
Distributed, Switched Computing Architecture: A single Slice processing element can be organized as 2-16 way SMP nodes. Up to four Processor Slices with up to 64 cores can be configured in a single 5U Subrack. The cluster fabric, Internal to the Subrack uses InfiniBand switches and links, for superior (low) memory-to-memory transfer latency and scalable bandwidth. Subrack clusters can be configured using either Gig-E or InfiniBand. Themis Slice Subracks can be combined with IBM or Sun Servers, in heterogeneous networks, using either networking technology. At the Subrack level, Themis Slice technology is a truly open architecture that offers superior SWAP and environmental resiliency.
Themis Slice Price and Availability
Processor Slices are priced from $10,500. Processor Slice configurations bundled with the subrack docking station and power supplies, are priced from $26,000, in OEM quantities. Please contact factory for evaluation units or for volume order requirements.
See Themis’ new Quorum and Slice solutions at LinuxWorld in Boston, MA April 4-6 in Booth #836 and at Sea-Air-Space 2006 Expo in Washington, DC in Booth #4001 April 4-6.
About Themis Computer
Themis Computer is a leading developer and supplier of high performance VME and Compact PCI single-board computers, as well as systems for mission-critical telecommunications, military/aerospace, and industrial embedded applications. Themis provides open standards-based embedded computing platforms that support the Solaris, Linux, and Windows operating systems. Themis’ products incorporate features designed to ensure high reliability and availability while reducing the risks of failure caused by extreme environments. An ISO 9001 certified company, Themis Computer practices Total Quality Management (TQM) in all areas of its business, from engineering and manufacturing to customer service. Themis Computer is headquartered in Fremont, California and offers worldwide service and support. For more information please visit www.themis.com or email: [email protected].
Themis, the Themis logo, Rugged Enterprise Server, Themis Slice, Themis Slice Processor Module, Themis Slice Storage Module, Themis Slice Power Module, Themis Slice Switch are trademarks or registered trademarks of Themis Computer. Sun, Sun Microsystems, and Solaris are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. UltraSPARC and SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. Windows is a registered trademark of Microsoft Corporation. Linux is a registered trademark of Linus Torvalds. All other trademarks and registered trademarks are the property of their respective owners.