VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  Pixus Technologies Offers New Recessed Chassis Options for EMC
New Products

Pixus Technologies Offers New Recessed Chassis Options for EMC

Pixus TechnologiesPixus Technologies—January 9, 20130
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail



Waterloo, Ontario — Jan 9, 2013 – Pixus Technologies, a supplier of backplane, chassis, and embedded component solutions, now offers enclosures with the subrack recessed within the enclosure frame for additional protection, including EMC considerations.

More stories

High Density High Speed D/a Pmc Module

May 17, 2010

TAICENN New Released industrial and embedded Box IPC

October 9, 2017

Crystek Maximizes Performance and Efficiency in New 6400 MHz Coaxial Resonator Oscillator (CRO)

April 12, 2013

Curtiss-Wright Controls Electronic Systems Introduces New Hybricon(r) 6U OpenVPX(tm) Backplane

July 26, 2011

Pixus’ new enclosure option can be recessed in various depths according to the customer’s requirements. The design allows the subrack and boards to be completely protected inside the enclosure frame, preventing damage to the modules, limiting exposure to dust, and reducing the susceptibility of EMI/RFI. An optional side or bottom-hinged door allows the case to be fully enclosed or even locked.

The first in the recessed series are 7U and 9U versions, which accommodate 6U pluggable boards (with 1U-3U of space for various fan/airflow configurations). Versions for 3U pluggable boards in a 4U overall height are also available. Backplanes are available in OpenVPX, CompactPCI/2.16, PCIe Gen2 or Gen3, VME64x, VXS or custom. Utilizing a modular construction, the sizes and options available are highly versatile. In many applications, engineers will utilize a portion of the subrack area for the embedded computer boards and the other section for their specialized devices. Provisions for mounting of custom devices are easily implemented in the modular enclosure.

Cooling options for the recessed enclosure series are dependent on the application requirements. Front-to-rear or bottom-to-top cooling options are standard in the 7U to 9U sizes. A wide range of AC or DC power supplies are available. System monitoring and management is also an option.

About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on ATCA, OpenVPX, PCIe and custom designs. Pixus also has an extensive library of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the exclusive North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.

Pixus Technologies is actively involved in the continuous development of leading AdvancedTCA, OpenVPX, and cPCI/PCIe products that will surpass all data transfer and cooling challenges.

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Gaia Converter simplifies Avionic AC-DC power supply design with HGMM Series Power Factor Correction Converters
UK Device Developers’ Conference Set for May 2013
Related posts
  • Related posts
  • More from author
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Load more
Read also
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Eletter Products

SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O

August 9, 20230
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

August 9, 20230
Eletter Products

SPONSORED: Chassis Management Family Ensures Efficient Operation in Systems Aligned to SOSA

August 8, 20230
Load more

Recent Posts

  • DÉJÀ VU – THE UBIQUITY OF VITA 57
  • Attn. VITA members: Registration open for September 2023 VSO Face to Face
  • TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications
  • SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O
  • SPONSORED: SpaceVPX Solutions From Pixus Technologies

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.