VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  DN3-SHARK • Dual Port SFP+ 10 Gigabit Ethernet NIC XMC Module
New Products

DN3-SHARK • Dual Port SFP+ 10 Gigabit Ethernet NIC XMC Module

EKF-ELECTRONIK GmbHEKF-ELECTRONIK GmbH—October 9, 20150
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

Curtiss-Wright Controls Defense Solutions’ New 13U OpenVPX(tm) Forced Air Conduction Cooled Development Chassis Cools >150W Per Slot

January 17, 2012

Curtiss-Wright Controls Debuts Low-Cost Rugged, Removable Solid State Memory Module Carrier

December 18, 2013

TE Connectivity’s high frequency nanominiature contact doubles density, reduces packaging

November 6, 2018

Curtiss-Wright Debuts Industry’s First High-Speed 40Gbps Gen3 OpenVPX(tm) Backplane

November 20, 2013


Front view

Front view


Cables attached

Cables attached

EKF introduces the DN3-SHARK, an XMC standard mezzanine card, equipped with a dual port 10Gbps Ethernet controller. Both ports are available via SFP+ front bezel connector cages, suitable for attachment of either optical cables via SFP+ transceivers or SFP+ twinaxial copper cables. The Intel® 82599ES Ethernet NIC is known for its high performance, low latency, reliability, and flexibility.

The DN3-SHARK is backward compatible to 1Gbps and 100Mbps speeds. The optimum performance can be achieved with a Gen2 PCIe x 8 link established to the XMC carrier. Intel® networking drivers are available for all major operating systems. The DN3-SHARK is a perfect solution for applications with demand for high throughput industrial networking.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
New XMC Modules Feature Xilinx® Artix®-7 FPGA
CERDEC Becomes VITA’s Newest Sponsor Member, Driving Initiatives to Develop the U.S. Army’s Modular Open RF Architecture (MORA)
Related posts
  • Related posts
  • More from author
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Load more
Read also
Consortia and Working Groups

Ratification of VITA 93 – QMC: TEWS Technologies Welcomes a New Era in Modular I/O

September 30, 20250
Articles

VITA Persona: Ovidiu Mesesan

September 29, 20250
Articles

Legacy Product Sustainment Has Improved — But It Can Get Even Better

September 29, 20250
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.